Calculated based on number of publications stored in Pure and citations from Scopus
1986 …2023

Research activity per year

If you made any changes in Pure these will be visible here soon.

Network

P. Srinivasan

  • Interuniversitair Micro-Elektronica Centrum
  • New Jersey Institute of Technology
  • The Electrochemical Society
  • Global Foundries, Inc.
  • Aixtron SE
  • IEEE
  • Department of Electrical and Computer Engineering
  • Advanced Networking Laboratory
  • Department of Electrical Engineering
  • IMEC

External person

M. N. Bhuyian

  • New Jersey Institute of Technology
  • GLOBALFOUNDRIES US Inc
  • Department of Electrical and Computer Engineering
  • Global Foundries, Inc.

External person

N. Chowdhury

  • SEMATECH
  • New Jersey Institute of Technology
  • Spansion Inc.
  • Department of Electrical and Computer Engineering
  • Advanced Networking Laboratory
  • Department of Electrical Engineering
  • NJ Inst. of Tech.

External person

Y. M. Ding

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering
  • Electrical and Computer Engineering Department of Electrical and Computer Engineering
  • Western Digital Corporation

External person

K. Tapily

  • TEL Technology Center, America, LLC
  • TEL Technology Center, America, LLC
  • Tokyo Electron Limited

External person

S. Consiglio

  • TEL Technology Center, America, LLC
  • TEL Technology Center, America, LLC
  • Tokyo Electron Limited

External person

G. J. Leusink

  • TEL Technology Center, America, LLC
  • TEL Technology Center, America, LLC
  • Tokyo Electron Limited

External person

C. S. Wajda

  • TEL Technology Center, America, LLC
  • TEL Technology Center, America, LLC
  • Tokyo Electron Limited

External person

E. Simoen

  • Interuniversitair Micro-Elektronica Centrum
  • The Electrochemical Society
  • IMEC

External person

R. D. Clark

  • TEL Technology Center, America, LLC
  • TEL Technology Center, America, LLC
  • Tokyo Electron Limited

External person

N. Rahim

  • New Jersey Institute of Technology
  • Global Foundries, Inc.
  • The Electrochemical Society
  • Department of Electrical and Computer Engineering

External person

R. Garg

  • New Jersey Institute of Technology
  • IBM
  • IEEE
  • Department of Electrical and Computer Engineering
  • Advanced Networking Laboratory
  • Department of Electrical Engineering
  • NJ Inst. of Tech.

External person

S. K. Sahoo

  • National Renewable Energy Laboratory
  • New Jersey Institute of Technology
  • SUNY Albany
  • Department of Electrical and Computer Engineering
  • Physics Department

External person

P. K. Swain

  • Sarnoff Corporation
  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering

External person

C. Claeys

  • Interuniversitair Micro-Elektronica Centrum
  • KU Leuven
  • The Electrochemical Society
  • ESAT Department
  • E.E. Department
  • Electrical Engg. Dept.
  • Department of Electrical Engineering
  • IMEC

External person

R. K. Jarwal

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering
  • Advanced Networking Laboratory
  • Department of Electrical Engineering

External person

L. Pantisano

  • Interuniversitair Micro-Elektronica Centrum
  • The Electrochemical Society
  • Global Foundries, Inc.

External person

T. Kundu

  • New Jersey Institute of Technology
  • Micron Technology
  • Department of Electrical and Computer Engineering
  • Micron Technology Incorporated

External person

Yaw Obeng

  • National Institute of Standards and Technology
  • New Jersey Institute of Technology

External person

E. L. Heasell

  • University of Waterloo
  • Department of Electrical Engineering
  • Department of Electrical Engineering

External person

P. C. Paliwoda

  • New Jersey Institute of Technology
  • Global Foundries, Inc.
  • Reliability Engineering GLOBALFOUNDRIES Inc.
  • Department of Electrical and Computer Engineering

External person

Y. N. Mohapatra

  • Indian Institute of Technology Kanpur
  • Materials Science Programme

External person

D. C. Agrawal

  • Indian Institute of Technology Kanpur

External person

N. Bhat

  • Indian Institute of Science Bangalore
  • CeNSE
  • Center for Nano Science and Engineering (CeNSE)
  • Center for Nano Science and Engineering

External person

Andreas Kerber

  • Global Foundries, Inc.
  • Reliability Engineering GLOBALFOUNDRIES Inc.

External person

Stefan De Gendt

  • Interuniversitair Micro-Elektronica Centrum
  • National Institute of Standards and Technology

External person

Zakariae Chbili

  • Global Foundries, Inc.
  • Reliability Engineering GLOBALFOUNDRIES Inc.
  • Intel

External person

R. D. Clark

  • TEL Technology Center, America, LLC

External person

C. Young

  • SEMATECH

External person

T. Chikyow

  • National Institute for Materials Science Tsukuba

External person

R. Liu

  • Lucent
  • Nokia

External person

W. Y.C. Lai

  • Nokia
  • Lucent

External person

B. Vootukuru

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering
  • Advanced Networking Laboratory

External person

H. Bakhru

  • SUNY Albany
  • College of Nanoscale Science and Engineering
  • SUNY
  • SUNY Albany
  • SUNY
  • SUNY Polytechnic Institute

External person

C. T. Liu

  • Lucent
  • Nokia
  • IEEE
  • Lucent Technologies

External person

H. Iwai

  • Tokyo Institute of Technology
  • IEEE
  • National Yang Ming Chiao Tung University
  • Frontier Collaborative Research Center

External person

Vinay Budhraja

  • National Renewable Energy Laboratory
  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering

External person

K. L. Ganapathi

  • Indian Institute of Science Bangalore
  • CeNSE
  • Center for Nano Science and Engineering (CeNSE)
  • Indian Institute of Technology Madras

External person

C. P. Chang

  • Nokia
  • Lucent

External person

R. Choi

  • SEMATECH

External person

J. I. Colonell

  • Nokia
  • Lucent

External person

C. Claeys

  • Interuniversitair Micro-Elektronica Centrum
  • KU Leuven
  • E.E. Department
  • Dept. of Electrical Engineering
  • Electrical Engineering Department

External person

C. S. Pai

  • Nokia
  • Lucent

External person

G. Nakamura

  • TEL Technology Center, America, LLC
  • Tokyo Electron Limited

External person

P. Kharangarh

  • New Jersey Institute of Technology
  • Apollo CdTe Solar Energy Center
  • University Heights
  • Department of Physics
  • Apollo CdTe Solar Energy Center (Pending)
  • Department of Physics
  • Dept. of Physics
  • University of Delhi
  • Indian Institute of Science Bangalore

External person

Bauza, D.

  • Institut de Microelectronique

External person

Ranyang Zhou

  • New Jersey Institute of Technology

External person

Dhruv Singh

  • Global Foundries, Inc.
  • Reliability Engineering GLOBALFOUNDRIES Inc.

External person

K. P. Cheung

  • Lucent
  • Nokia

External person

S. Kishore

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering
  • Department of Chemistry and Environmental Science

External person

M. Bhaskaran

  • Sarnoff Corporation

External person

Shaahin Angizi

  • High Point University
  • New Jersey Institute of Technology

External person

D. H. Triyoso

  • TEL Technology Center, America, LLC

External person

Vipulkumar Patel

  • Sarnoff Corporation
  • New Jersey Institute of Technology
  • Electronic Imaging Center

External person

Arman Roohi

  • University of Nebraska-Lincoln

External person

K. Sundaram

  • University of Central Florida

External person

Hiroshi Iwai

  • National Yang Ming Chiao Tung University

External person

Karim, Zia

  • Texas Instruments
  • Aixtron SE

External person

Trupti Ranjan Lenka

  • National Institute of Technology Silchar

External person

P. Zhao

  • New Jersey Institute of Technology

External person

Salvatore Cimino

  • Global Foundries, Inc.

External person

H. Y. Yu

  • Interuniversitair Micro-Elektronica Centrum
  • IMEC

External person

Zimeng Cheng

  • New Jersey Institute of Technology
  • Apollo CdTe Solar Energy Center
  • Department of Physics
  • Apollo CdTe Solar Energy Center (Pending)
  • Department of Physics and CNBM New Energy Materials Research Center
  • Dept. of Physics

External person

Ralph Bucher

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering

External person

S. B. Majumder

  • Indian Institute of Technology Kharagpur

External person

D. Peter Siddons

  • Brookhaven National Laboratory

External person

B. Singh

  • Sarnoff Corporation

External person

Hemanth Jagannathan

  • IBM Research
  • IBM

External person

Z. M. Rittersma

  • Koninklijke Philips N.V.

External person

F. Crupi

  • University of Calabria
  • National Research Council of Italy
  • Dipartimento di Elettronica, Informatica e Sistemistica
  • Istituto per la Microelettronica e Microsistemi

External person

R. Singanamalla

  • KU Leuven
  • Interuniversitair Micro-Elektronica Centrum
  • Electrical Engg. Dept.
  • IMEC

External person

James Piao

  • Epitaxial Laboratory Inc.

External person

Tanya Nigam

  • Global Foundries, Inc.

External person

B. Jain

  • Department of Electrical and Computer Engineering
  • New Jersey Institute of Technology

External person

C. Pace

  • University of Calabria
  • National Research Council of Italy
  • Dipartimento di Elettronica, Informatica e Sistemistica
  • Istituto per la Microelettronica e Microsistemi

External person

Mehrdad Djavid

  • McGill University
  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering

External person

B. Sopori

  • New Jersey Institute of Technology
  • National Renewable Energy Laboratory
  • National Center for Photovoltaics

External person

T. R. Viswanathan

  • University of Waterloo
  • Department of Electrical Engineering

External person

Colin A. Wolden

  • Colorado School of Mines
  • Chemical and Biological Engineering

External person

S. Mukhopadhyay

  • Department of Electrical and Computer Engineering
  • New Jersey Institute of Technology

External person

Minhee Kim

  • New Jersey Institute of Technology
  • Department of Chemistry and Environmental Science

External person

Xiaofang Wang

  • New Jersey Institute of Technology
  • Villanova University
  • Department of Electrical and Computer Engineering
  • Electrical and Computer Engineering Dept
  • Advanced Networking Laboratory
  • Department of Electrical Engineering
  • Dept. of Electrical and Computer Engineering
  • Villa nova University

External person

K. Nagahiro

  • Global Foundries, Inc.

External person

Z. Chen

  • University of Kentucky

External person

Bingda Wang

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering
  • Electrical and Computer Engineering Departnent

External person

P. P. Manik

  • Global Foundries, Inc.

External person

P. Shao

  • Department of Electrical and Computer Engineering
  • New Jersey Institute of Technology

External person

P. Magnone

  • University of Calabria
  • Dipartimento di Elettronica, Informatica e Sistemistica

External person

R. S. Katiyar

  • University of Puerto Rico
  • Department of Physics

External person

V. Kaushik

  • SUNY Polytechnic Institute

External person

K. Kakushima

  • Tokyo Institute of Technology

External person

Roman Brukh

  • New Jersey Institute of Technology
  • Rutgers - The State University of New Jersey, Newark
  • Department of Chemistry and Environmental Science
  • Department of Chemistry
  • Department of Chemistry

External person

Mingming Zhang

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering

External person

Lowrance, John L.

  • Sarnoff Corporation
  • IEEE
  • Princeton Scientific Instruments Inc.

External person

A. Sengupta

  • Heritage Institute of Technology
  • Department of ECE
  • Maulana Abul Kalam Azad University of Technology

External person

F. Roozeboom

  • Koninklijke Philips N.V.
  • Eindhoven University of Technology
  • Thermal Process Solutions Limited

External person

Arun N. Chandorkar

  • Indian Institute of Technology Bombay
  • Center of Excellence in Nanoelectronics
  • Center of Excellence in Nanoelectronics

External person

D. D. Choudhary

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering

External person

R. J. Greene

  • New Jersey Institute of Technology
  • Department of Biomedical Engineering
  • Department of Biomedical Engineering
  • Department of Biomediacl Engineering
  • Department of Physics
  • Biomedical Engineering

External person

C. S. Wajd

  • New Jersey Institute of Technology
  • TEL Technology Center, America, LLC
  • Department of Electrical and Computer Engineering

External person

Chuan Hsi Liu

  • Department of Mechatronic Technology
  • National Taiwan Normal University

External person

Wei Zhong

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering

External person

P. Snnivasan

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering

External person

Kiran Gururaj

  • New Jersey Institute of Technology
  • Department of Electrical Engineering

External person

Kamal Joshi

  • New Jersey Institute of Technology
  • Human Resources Information Systems
  • NJIT

External person

R. Sengupta

  • Heritage Institute of Technology
  • Department of Electronics and Communication Engineering

External person

Guogen Liu

  • New Jersey Institute of Technology
  • Apollo CdTe Solar Energy Center
  • Department of Physics and CNBM New Energy Materials Research Center
  • Department of Physics
  • Chemical
  • Department of Chemical, Biological and Pharmaceutical Engineering
  • Dept. of Physics
  • Apollo CdTe Solar Energy Center (Pending)

External person

I. Mitevski

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering

External person

Yagneshwara R. Vadapalli

  • New Jersey Institute of Technology
  • Department of Electrical Engineering

External person

Charles Surya

  • Innovation and Technology Commission

External person

P. Vurikiti

  • Heritage Institute of Technology
  • Department of Electronics and Communication Engineering

External person

Harsimranjit Singh

  • Department of Mechanical and Industrial Engineering
  • New Jersey Institute of Technology

External person

B. De Jaeger

  • Interuniversitair Micro-Elektronica Centrum

External person

K. Wörhoff

  • University of Twente

External person

M. Patel

  • New Jersey Institute of Technology
  • Microelectronics Research Center

External person

Angelique Raley

  • TEL Technology Center, America, LLC

External person

Paul A. Taylor

  • Medical College of Wisconsin
  • Rutgers - The State University of New Jersey, Newark
  • University of Cape Town
  • African Institute for Mathematical Sciences
  • National Institutes of Health, Bethesda
  • National Institutes of Health
  • MRC/UCT Medical Imaging Research Unit
  • Scientific and Statistical Computing Core
  • Department of Human Biology
  • MRC/UCT Medical Imaging Research Unit
  • Department of Health and Human Services
  • Biophysics Research Institute
  • Department of Radiology
  • Department of Radiology
  • Department of Radiology
  • Rutgers - The State University of New Jersey, New Brunswick

External person

K. P. Cheung

  • Lucent
  • Nokia

External person

Bharath Babu Nunna

  • New Jersey Institute of Technology
  • Department of Mechanical and Industrial Engineering
  • Harvard University
  • Department of Medicine
  • Weber State University

External person

Toledano-Luque, Maria

  • Global Foundries, Inc.

External person

K. Jyothi

  • Indian Institute of Technology Bombay
  • Center of Excellence in Nanoelectronics

External person

S. DeGendt

  • KU Leuven

External person

V. S. Simhadri

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering

External person

H. K. Sehgal

  • New Jersey Institute of Technology

External person

Min, Byoung Woon

  • Global Foundries, Inc.

External person

Khai Q. Le

  • Hoa Sen University
  • University of Minnesota Twin Cities
  • Ton Duc Thang University
  • Jazan University
  • Faculty of Electrical and Electronics Engineering
  • Division of Computational Physics
  • Faculty of Science and Technology
  • Department of Physics
  • Center for Mesoscopic Sciences
  • National Institutes of Natural Sciences - Institute for Molecular Science
  • Department of Electrical Engineering
  • Hoa Sen University
  • Faculty of Science and Technology
  • Department of Electrical Engineering
  • University of Minnesota Duluth
  • University of Minnesota Duluth

External person

Joo Un Lee

  • New Jersey Institute of Technology

External person

Abhay Joshi

  • Discovery Semiconductors
  • Discovery Semiconductors, Inc

External person

Arindam Biswas

  • Kazi Nazrul University

External person

Gianluigi De Geronimo

  • Brookhaven National Laboratory

External person

Albert Wang

  • University of California at Riverside

External person

C. R. Selvakumar

  • University of Waterloo
  • Department of Electrical and Computer Engineering

External person

N. Ciampa

  • Department of Physics
  • New Jersey Institute of Technology

External person

Rui Yuan

  • New Jersey Institute of Technology
  • Department of Biomedical Engineering
  • Department of Electrical Engineering
  • Stanford University

External person

S. Liu

  • New Jersey Institute of Technology
  • Polarization Solutions LLC
  • Department of Physics

External person

D. Heh

  • SEMATECH

External person

T. A. Gessert

  • National Renewable Energy Laboratory

External person

Qiming Shao

  • Hong Kong University of Science and Technology

External person

Haijiang Ou

  • New Jersey Institute of Technology
  • Department of Physics

External person

Lev Zakrevski

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering

External person

D. M. Guldi

  • Friedrich-Alexander University Erlangen-Nürnberg

External person

Mastrocola, Vincent

  • Sarnoff Corporation

External person

Gondal, A.

  • Global Foundries, Inc.

External person

Yuvraj Patel

  • New Jersey Institute of Technology

External person

T. H.Q. Bui

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering

External person

Hitoshi Wakabayashi

  • Tsinghua University

External person

W. Zhong

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering

External person

G. Wang

  • New Jersey Institute of Technology

External person

Y. Ma

  • Lucent

External person

Cvelbar, U.

  • J. Stefan Institute

External person

Moab Rajan Philip

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering
  • Leonardo Electronics Us Inc.

External person

Shuji Ikeda

  • TEI Solutions

External person

E. P. Gusev

  • Qualcomm Incorporated

External person

Jeffrey Johnson

  • Global Foundries, Inc.

External person

M. Sunkara

  • University of Louisville

External person

Zhixiong Xiao

  • New Jersey Institute of Technology
  • Department of Physics
  • Microelectronics Research Center

External person

Vernon, Emerson

  • Brookhaven National Laboratory

External person

Z. Karim

  • Yield Engineering Systems

External person

K. K. China

  • New Jersey Institute of Technology
  • Department of Physics

External person

Jianshi Tang

  • Tsinghua University

External person

P. E. Thompson

  • Naval Research Laboratory

External person

Sarap, B. K.

  • Institute of Technical Education and Research of Siksha O Anusandhan University

External person

O. W. Purbo

  • Bandung Institute of Technology

External person

Baoqing Li

  • New Jersey Institute of Technology
  • Department of Applied Physics
  • Department of Physics

External person

S. Datta

  • Pennsylvania State University

External person

Zhiwei Liu

  • New Jersey Institute of Technology
  • Department of Physics
  • Center for Solar-Terrestrial Research

External person

Gyana Pattanaik

  • TEL Technology Center, America, LLC

External person

W. Deweerd

  • Interuniversitair Micro-Elektronica Centrum

External person

S. Sultana

  • Center for Nano Science and Engineering
  • Indian Institute of Science Bangalore

External person

Robert S. Friedman

  • New Jersey Institute of Technology
  • College of Computing Sciences
  • Information Technology Department
  • Undergraduate Program

External person

Arokia Nathan

  • University of Cambridge

External person

Debdyuti Mandal

  • New Jersey Institute of Technology
  • Department of Mechanical and Industrial Engineering

External person

C. S. Huang

  • Department of Electrical and Computer Engineering
  • New Jersey Institute of Technology

External person

R. M. Sankaran

  • Case Western Reserve University

External person

Kabra, Rakesh K.

  • Sarnoff Corporation

External person

Wu, Ernest Y.

  • Global Foundries, Inc.

External person

S. Poddar

  • Heritage Institute of Technology
  • Department of Electronics and Communication Engineering
  • Maulana Abul Kalam Azad University of Technology

External person

William N. Carr

  • New Jersey Institute of Technology
  • Telcordia Technologies
  • Physics and the Electrical Engineering Departments
  • Department of Physics
  • Department of Electrical and Computer Engineering

External person

P. Mascher

  • McMaster University

External person

Lan Fu

  • Australian National University

External person

Lee, Kuan Wei

  • I-Shou University
  • Department of Electronic Engineering

External person

C. R. Selvakumar

  • University of Waterloo

External person

C. A. MacDonald

  • SUNY Albany
  • Physics Department

External person

Tristan Ventura

  • Rutgers - The State University of New Jersey, New Brunswick

External person

M. Rajan Philip

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering

External person

Akira Toriumi

  • The University of Tokyo

External person

Xiaodong Wang

  • New Jersey Institute of Technology
  • SUNY Albany
  • Department of Applied Physics
  • Department of Physics
  • College of Nanoscale Science and Engineering
  • Microelectronics Research Center
  • University at Albany-SUNY
  • SUNY Polytechnic Institute

External person

Lee

  • SEMATECH

External person

G. J. Leusink

  • TEL Technology Center, America, LLC

External person

T. Hakamata

  • TEL Technology Center, America, LLC

External person

Zhi Yong Li

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering

External person

Andrei Fluerasu

  • Brookhaven National Laboratory
  • Center for Functional Nanomaterials

External person

Kanzhu Guo

  • Department of Physics
  • Department of Physics, Rutgers University-Newark Campus
  • Rutgers - The State University of New Jersey, Newark
  • Department of Physics
  • Department of Applied Physics

External person

J. Opyrchal

  • New Jersey Institute of Technology
  • Department of Physics

External person

S. Ayyagari

  • New Jersey Institute of Technology

External person

Jianjun Zhen

  • Department of Physics
  • New Jersey Institute of Technology

External person

Chen Yang

  • Analog Devices, Inc.

External person

Jyothi Kasinath

  • Indian Institute of Technology Bombay
  • Center of Excellence in Nanoelectronics

External person

M. Koyanagi

  • Tohoku University

External person

Yi Li

  • Huazhong University of Science and Technology

External person

P. J. Timans

  • Eindhoven University of Technology

External person

Huaqiang Wu

  • Tokyo Institute of Technology

External person

Ziyan Cheng

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering

External person

Vishnu Mandava

  • New Jersey Institute of Technology
  • Department of Electrical Engineering

External person

D. J. Roulston

  • University of Waterloo

External person

Shiqiang Zhuang

  • New Jersey Institute of Technology
  • Department of Mechanical and Industrial Engineering
  • Department of Mechanical Engineering
  • Jinan University
  • University of Jinan

External person

T. T. Pham

  • Vietnam National University Ho Chi Minh City
  • Center for Innovative Materials and Architectures
  • Ho Chi Minh City University of Technology

External person

Grycewicz, Thomas

  • United States Air Force Academy

External person

K. Kondo

  • Osaka Metropolitan University

External person

W. F. Kosonocky

  • New Jersey Institute of Technology
  • Electronic Imaging Center
  • Department of Electrical and Computer Engineering

External person

Hoang Duy Nguyen

  • Vietnam Academy of Science and Technology
  • Vietnamese Academy of Science and Technology
  • Institute of Applied Materials Science
  • Vietnam National University Ho Chi Minh City

External person

J. Fenton

  • University of Central Florida

External person

Xuehai Tan

  • Department of Physics and CNBM New Energy Materials Research Center
  • New Jersey Institute of Technology
  • Department of Physics

External person

M. Sahoo

  • SUNY Albany
  • Department of Computer Science

External person

S. Madapur

  • II-VI Incorporated
  • Department of Electrical and Computer Engineering
  • New Jersey Institute of Technology

External person

Emily Lattanzio

  • High Point University

External person

A. Peralta

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering

External person

R. A. Bartynski

  • Rutgers - The State University of New Jersey, New Brunswick
  • Department of Physics

External person

G. Nakamur

  • New Jersey Institute of Technology
  • TEL Technology Center, America, LLC
  • Department of Electrical and Computer Engineering

External person

M. Cole

  • New Jersey Institute of Technology

External person

Hei Wong

  • City University of Hong Kong
  • Department of Electronic Engineering

External person

Xinde Wang

  • Discovery Semiconductors
  • Discovery Semiconductors, Inc

External person

Tower, John

  • Sarnoff Corporation

External person

Vladimir Briller

  • New Jersey Institute of Technology
  • Education Development Center
  • Vera Inst. of Justice in New York
  • International Department in New York
  • Department of Electrical Engineering

External person

Christopher Cole

  • TEL Technology Center, America, LLC

External person