Calculated based on number of publications stored in Pure and citations from Scopus
1986 …2024

Research activity per year

Network

P. Srinivasan

  • Interuniversitair Micro-Elektronica Centrum
  • New Jersey Institute of Technology
  • The Electrochemical Society
  • Global Foundries, Inc.
  • Aixtron SE
  • IEEE
  • Department of Electrical and Computer Engineering
  • Advanced Networking Laboratory
  • Department of Electrical Engineering
  • IMEC

External person

M. N. Bhuyian

  • New Jersey Institute of Technology
  • GLOBALFOUNDRIES US Inc
  • Department of Electrical and Computer Engineering
  • Global Foundries, Inc.

External person

N. Chowdhury

  • SEMATECH
  • New Jersey Institute of Technology
  • Spansion Inc.
  • Department of Electrical and Computer Engineering
  • Advanced Networking Laboratory
  • Department of Electrical Engineering
  • NJ Inst. of Tech.

External person

Y. M. Ding

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering
  • Electrical and Computer Engineering Department of Electrical and Computer Engineering
  • Western Digital Corporation

External person

K. Tapily

  • TEL Technology Center, America, LLC
  • TEL Technology Center, America, LLC
  • Tokyo Electron Limited

External person

S. Consiglio

  • TEL Technology Center, America, LLC
  • TEL Technology Center, America, LLC
  • Tokyo Electron Limited

External person

G. J. Leusink

  • TEL Technology Center, America, LLC
  • TEL Technology Center, America, LLC
  • Tokyo Electron Limited

External person

C. S. Wajda

  • TEL Technology Center, America, LLC
  • TEL Technology Center, America, LLC
  • Tokyo Electron Limited

External person

E. Simoen

  • Interuniversitair Micro-Elektronica Centrum
  • The Electrochemical Society
  • IMEC

External person

R. D. Clark

  • TEL Technology Center, America, LLC
  • TEL Technology Center, America, LLC
  • Tokyo Electron Limited

External person

N. Rahim

  • New Jersey Institute of Technology
  • Global Foundries, Inc.
  • The Electrochemical Society
  • Department of Electrical and Computer Engineering

External person

R. Garg

  • New Jersey Institute of Technology
  • IBM
  • IEEE
  • Department of Electrical and Computer Engineering
  • Advanced Networking Laboratory
  • Department of Electrical Engineering
  • NJ Inst. of Tech.

External person

S. K. Sahoo

  • National Renewable Energy Laboratory
  • New Jersey Institute of Technology
  • SUNY Albany
  • Department of Electrical and Computer Engineering
  • Physics Department

External person

P. K. Swain

  • Sarnoff Corporation
  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering

External person

Hiroshi Iwai

  • National Yang Ming Chiao Tung University
  • Tokyo Institute of Technology
  • IEEE

External person

C. Claeys

  • Interuniversitair Micro-Elektronica Centrum
  • KU Leuven
  • The Electrochemical Society
  • ESAT Department
  • E.E. Department
  • Electrical Engg. Dept.
  • Department of Electrical Engineering
  • IMEC

External person

R. K. Jarwal

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering
  • Advanced Networking Laboratory
  • Department of Electrical Engineering

External person

L. Pantisano

  • Interuniversitair Micro-Elektronica Centrum
  • The Electrochemical Society
  • Global Foundries, Inc.

External person

T. Kundu

  • New Jersey Institute of Technology
  • Micron Technology
  • Department of Electrical and Computer Engineering
  • Micron Technology Incorporated

External person

Yaw Obeng

  • National Institute of Standards and Technology
  • New Jersey Institute of Technology

External person

E. L. Heasell

  • University of Waterloo
  • Department of Electrical Engineering
  • Department of Electrical Engineering

External person

P. C. Paliwoda

  • New Jersey Institute of Technology
  • Global Foundries, Inc.
  • Reliability Engineering GLOBALFOUNDRIES Inc.
  • Department of Electrical and Computer Engineering

External person

Y. N. Mohapatra

  • Indian Institute of Technology Kanpur
  • Materials Science Programme

External person

D. C. Agrawal

  • Indian Institute of Technology Kanpur

External person

Andreas Kerber

  • Global Foundries, Inc.
  • Reliability Engineering GLOBALFOUNDRIES Inc.

External person

K. L. Ganapathi

  • Indian Institute of Science Bangalore
  • CeNSE
  • Center for Nano Science and Engineering (CeNSE)
  • Indian Institute of Technology Madras
  • National Institute of Technology Kurukshetra

External person

Stefan De Gendt

  • Interuniversitair Micro-Elektronica Centrum
  • National Institute of Standards and Technology

External person

Zakariae Chbili

  • Global Foundries, Inc.
  • Reliability Engineering GLOBALFOUNDRIES Inc.
  • Intel

External person

Arman Roohi

  • University of Nebraska-Lincoln
  • University of Central Florida
  • Independent Researcher
  • University of Central Florida

External person

R. D. Clark

  • TEL Technology Center, America, LLC
  • Tokyo Electron Limited

External person

C. Young

  • SEMATECH

External person

Ranyang Zhou

  • New Jersey Institute of Technology

External person

T. Chikyow

  • National Institute for Materials Science Tsukuba

External person

R. Liu

  • Lucent
  • Nokia

External person

W. Y.C. Lai

  • Nokia
  • Lucent

External person

B. Vootukuru

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering
  • Advanced Networking Laboratory

External person

H. Bakhru

  • SUNY Albany
  • College of Nanoscale Science and Engineering
  • SUNY
  • SUNY Albany
  • SUNY
  • SUNY Polytechnic Institute

External person

C. T. Liu

  • Lucent
  • Nokia
  • IEEE
  • Lucent Technologies

External person

Vinay Budhraja

  • National Renewable Energy Laboratory
  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering

External person

C. P. Chang

  • Nokia
  • Lucent

External person

R. Choi

  • SEMATECH

External person

J. I. Colonell

  • Nokia
  • Lucent

External person

C. Claeys

  • Interuniversitair Micro-Elektronica Centrum
  • KU Leuven
  • E.E. Department
  • Dept. of Electrical Engineering
  • Electrical Engineering Department

External person

C. S. Pai

  • Nokia
  • Lucent

External person

G. Nakamura

  • TEL Technology Center, America, LLC
  • Tokyo Electron Limited

External person

P. Kharangarh

  • New Jersey Institute of Technology
  • Apollo CdTe Solar Energy Center
  • University Heights
  • Department of Physics
  • Apollo CdTe Solar Energy Center (Pending)
  • Department of Physics
  • Dept. of Physics
  • University of Delhi
  • Indian Institute of Science Bangalore

External person

N. Bhat

  • Indian Institute of Science Bangalore
  • CeNSE
  • Center for Nano Science and Engineering (CeNSE)
  • Center for Nano Science and Engineering

External person

Dhruv Singh

  • Global Foundries, Inc.

External person

M. Bhaskaran

  • Sarnoff Corporation

External person

D. Bauza

  • Institut de Microelectronique

External person

D. H. Triyoso

  • TEL Technology Center, America, LLC
  • Tokyo Electron Limited

External person

Vipulkumar Patel

  • Sarnoff Corporation
  • New Jersey Institute of Technology
  • Electronic Imaging Center

External person

K. Sundaram

  • University of Central Florida

External person

Zia Karim

  • Texas Instruments
  • Aixtron SE

External person

Trupti Ranjan Lenka

  • National Institute of Technology Silchar

External person

P. Zhao

  • New Jersey Institute of Technology

External person

Mehrdad Morsali

  • New Jersey Institute of Technology

External person

X. Wang

  • Villanova University College of Engineering

External person

Fernando J. Costa

  • NJIT
  • Centro Universitário da FEI
  • New Jersey Institute of Technology

External person

A. Sengupta

  • Heritage Institute of Technology

External person

Aseel Zeinati

  • New Jersey Institute of Technology

External person

Salvatore Cimino

  • Global Foundries, Inc.

External person

H. Y. Yu

  • Interuniversitair Micro-Elektronica Centrum
  • IMEC

External person

Zimeng Cheng

  • New Jersey Institute of Technology
  • Apollo CdTe Solar Energy Center
  • Department of Physics
  • Apollo CdTe Solar Energy Center (Pending)
  • Department of Physics and CNBM New Energy Materials Research Center
  • Dept. of Physics

External person

Nakanta Bhat

  • Indian Institute of Science Bangalore

External person

Ralph Bucher

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering

External person

S. B. Majumder

  • Indian Institute of Technology Kharagpur

External person

D. Peter Siddons

  • Brookhaven National Laboratory

External person

W. Zhong

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering

External person

B. Singh

  • Sarnoff Corporation

External person

S. Kishore

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering
  • Department of Chemistry and Environmental Science

External person

Hemanth Jagannathan

  • IBM Research
  • IBM

External person

Z. M. Rittersma

  • Koninklijke Philips N.V.

External person

F. Crupi

  • University of Calabria
  • National Research Council of Italy
  • Dipartimento di Elettronica, Informatica e Sistemistica
  • Istituto per la Microelettronica e Microsistemi

External person

R. Singanamalla

  • KU Leuven
  • Interuniversitair Micro-Elektronica Centrum
  • Electrical Engg. Dept.
  • IMEC

External person

James Piao

  • Epitaxial Laboratory Inc.

External person

Tanya Nigam

  • Global Foundries, Inc.

External person

B. Jain

  • Department of Electrical and Computer Engineering
  • New Jersey Institute of Technology

External person

C. Pace

  • University of Calabria
  • National Research Council of Italy
  • Dipartimento di Elettronica, Informatica e Sistemistica
  • Istituto per la Microelettronica e Microsistemi

External person

Mehrdad Djavid

  • McGill University
  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering

External person

Renan Trevisoli

  • Pontifícia Universidade Católica de São Paulo
  • Insper

External person

B. Sopori

  • New Jersey Institute of Technology
  • National Renewable Energy Laboratory
  • National Center for Photovoltaics

External person

T. R. Viswanathan

  • University of Waterloo
  • Department of Electrical Engineering

External person

Colin A. Wolden

  • Colorado School of Mines
  • Chemical and Biological Engineering

External person

S. Mukhopadhyay

  • Department of Electrical and Computer Engineering
  • New Jersey Institute of Technology

External person

K. Nagahiro

  • Global Foundries, Inc.

External person

Z. Chen

  • University of Kentucky

External person

Mingming Zhang

  • New Jersey Institute of Technology

External person

Bingda Wang

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering
  • Electrical and Computer Engineering Departnent

External person

P. P. Manik

  • Global Foundries, Inc.

External person

P. Magnone

  • University of Calabria
  • Dipartimento di Elettronica, Informatica e Sistemistica

External person

R. S. Katiyar

  • University of Puerto Rico
  • Department of Physics

External person

V. Kaushik

  • SUNY Polytechnic Institute

External person

K. Kakushima

  • Tokyo Institute of Technology

External person

Roman Brukh

  • New Jersey Institute of Technology
  • Rutgers - The State University of New Jersey, Newark
  • Department of Chemistry and Environmental Science
  • Department of Chemistry
  • Department of Chemistry

External person

Andrew Marshall

  • University of Texas at Dallas
  • University of Texas at Dallas

External person

John L. Lowrance

  • Sarnoff Corporation
  • IEEE
  • Princeton Scientific Instruments Inc.

External person

F. Roozeboom

  • Koninklijke Philips N.V.
  • Eindhoven University of Technology
  • Thermal Process Solutions Limited

External person

Arun N. Chandorkar

  • Indian Institute of Technology Bombay
  • Center of Excellence in Nanoelectronics
  • Center of Excellence in Nanoelectronics

External person

Rodrigo T. Doria

  • Centro Universitário da FEI

External person

D. D. Choudhary

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering

External person

R. J. Greene

  • New Jersey Institute of Technology
  • Department of Biomedical Engineering
  • Department of Biomedical Engineering
  • Department of Biomediacl Engineering
  • Department of Physics
  • Biomedical Engineering
  • Tulane University School of Science and Engineering

External person

C. S. Wajd

  • New Jersey Institute of Technology
  • TEL Technology Center, America, LLC
  • Department of Electrical and Computer Engineering
  • Tokyo Electron Limited

External person

Chuan Hsi Liu

  • Department of Mechatronic Technology
  • National Taiwan Normal University

External person

P. Snnivasan

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering

External person

Kiran Gururaj

  • New Jersey Institute of Technology
  • Department of Electrical Engineering

External person

Kamal Joshi

  • New Jersey Institute of Technology
  • Human Resources Information Systems
  • NJIT

External person

R. Sengupta

  • Heritage Institute of Technology
  • Department of Electronics and Communication Engineering

External person

Guogen Liu

  • New Jersey Institute of Technology
  • Apollo CdTe Solar Energy Center
  • Department of Physics and CNBM New Energy Materials Research Center
  • Department of Physics
  • Chemical
  • Department of Chemical, Biological and Pharmaceutical Engineering
  • Dept. of Physics
  • Apollo CdTe Solar Energy Center (Pending)

External person

S. Sultana

  • Indian Institute of Science Bangalore

External person

I. Mitevski

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering

External person

Yagneshwara R. Vadapalli

  • New Jersey Institute of Technology
  • Department of Electrical Engineering

External person

Charles Surya

  • Innovation and Technology Commission

External person

P. Vurikiti

  • Heritage Institute of Technology
  • Department of Electronics and Communication Engineering

External person

B. De Jaeger

  • Interuniversitair Micro-Elektronica Centrum

External person

K. Wörhoff

  • University of Twente

External person

M. Patel

  • New Jersey Institute of Technology
  • Microelectronics Research Center

External person

Angelique Raley

  • TEL Technology Center, America, LLC
  • Tokyo Electron Limited

External person

Paul A. Taylor

  • Medical College of Wisconsin
  • Rutgers - The State University of New Jersey, Newark
  • University of Cape Town
  • African Institute for Mathematical Sciences
  • National Institutes of Health, Bethesda
  • National Institutes of Health
  • MRC/UCT Medical Imaging Research Unit
  • Scientific and Statistical Computing Core
  • Department of Human Biology
  • MRC/UCT Medical Imaging Research Unit
  • Department of Health and Human Services
  • Biophysics Research Institute
  • Department of Radiology
  • Department of Radiology
  • Department of Radiology
  • Rutgers - The State University of New Jersey, New Brunswick
  • African Institute for Mathematical Sciences

External person

Renjith Sasikumar

  • Indian Institute of Technology Palakkad

External person

Bharath Babu Nunna

  • New Jersey Institute of Technology
  • Department of Mechanical and Industrial Engineering
  • Harvard University
  • Department of Medicine
  • Weber State University

External person

G. Wang

  • New Jersey Institute of Technology

External person

Maria Toledano-Luque

  • Global Foundries, Inc.

External person

K. Jyothi

  • Indian Institute of Technology Bombay
  • Center of Excellence in Nanoelectronics

External person

S. DeGendt

  • KU Leuven

External person

V. S. Simhadri

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering

External person

H. K. Sehgal

  • New Jersey Institute of Technology

External person

Byoung Woon Min

  • Global Foundries, Inc.

External person

Khai Q. Le

  • Hoa Sen University
  • University of Minnesota Twin Cities
  • Ton Duc Thang University
  • Jazan University
  • Faculty of Electrical and Electronics Engineering
  • Division of Computational Physics
  • Faculty of Science and Technology
  • Department of Physics
  • Center for Mesoscopic Sciences
  • National Institutes of Natural Sciences - Institute for Molecular Science
  • Department of Electrical Engineering
  • Hoa Sen University
  • Faculty of Science and Technology
  • Department of Electrical Engineering
  • University of Minnesota Duluth

External person

Deniz Najafi

  • New Jersey Institute of Technology

External person

Joo Un Lee

  • New Jersey Institute of Technology

External person

Abhay Joshi

  • Discovery Semiconductors
  • Discovery Semiconductors, Inc

External person

Arindam Biswas

  • Kazi Nazrul University

External person

Gianluigi De Geronimo

  • Brookhaven National Laboratory

External person

Lan Fu

  • Australian National University

External person

G. B. Alers

  • Lucent
  • Nokia

External person

Albert Wang

  • University of California at Riverside

External person

C. R. Selvakumar

  • University of Waterloo
  • Department of Electrical and Computer Engineering

External person

N. Ciampa

  • Department of Physics
  • New Jersey Institute of Technology

External person

Rui Yuan

  • New Jersey Institute of Technology
  • Department of Biomedical Engineering
  • Department of Electrical Engineering
  • Stanford University

External person

S. Liu

  • New Jersey Institute of Technology
  • Polarization Solutions LLC
  • Department of Physics

External person

Jianshi Tang

  • Tsinghua University

External person

D. Heh

  • SEMATECH

External person

Sepehr Tabrizchi

  • University of Nebraska-Lincoln

External person

T. A. Gessert

  • National Renewable Energy Laboratory

External person

Qiming Shao

  • Hong Kong University of Science and Technology

External person

Haijiang Ou

  • New Jersey Institute of Technology
  • Department of Physics

External person

Lev Zakrevski

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering

External person

D. M. Guldi

  • Friedrich-Alexander University Erlangen-Nürnberg

External person

Vincent Mastrocola

  • Sarnoff Corporation

External person

A. Gondal

  • Global Foundries, Inc.

External person

T. H.Q. Bui

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering

External person

Hitoshi Wakabayashi

  • Tsinghua University

External person

Y. Ma

  • Lucent
  • Nokia

External person

U. Cvelbar

  • J. Stefan Institute

External person

Moab Rajan Philip

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering
  • Leonardo Electronics Us Inc.

External person

Shuji Ikeda

  • TEI Solutions

External person

E. P. Gusev

  • Qualcomm Incorporated

External person

Jeffrey Johnson

  • Global Foundries, Inc.

External person

S. Poddar

  • Heritage Institute of Technology

External person

M. Sunkara

  • University of Louisville

External person

Zhixiong Xiao

  • New Jersey Institute of Technology
  • Department of Physics
  • Microelectronics Research Center

External person

Emerson Vernon

  • Brookhaven National Laboratory

External person

Z. Karim

  • Yield Engineering Systems

External person

K. K. China

  • New Jersey Institute of Technology
  • Department of Physics

External person

P. E. Thompson

  • Naval Research Laboratory

External person

B. K. Sarap

  • Siksha ‘O’ Anusandhan University

External person

O. W. Purbo

  • Bandung Institute of Technology

External person

Baoqing Li

  • New Jersey Institute of Technology
  • Department of Applied Physics
  • Department of Physics

External person

P. Shao

  • New Jersey Institute of Technology

External person

S. Datta

  • Pennsylvania State University

External person

Zhiwei Liu

  • New Jersey Institute of Technology
  • Department of Physics
  • Center for Solar-Terrestrial Research

External person

Harsimranjit Singh

  • New Jersey Institute of Technology

External person

Gyana Pattanaik

  • TEL Technology Center, America, LLC
  • Tokyo Electron Limited

External person

W. Deweerd

  • Interuniversitair Micro-Elektronica Centrum

External person

Robert S. Friedman

  • New Jersey Institute of Technology
  • College of Computing Sciences
  • Information Technology Department
  • Undergraduate Program
  • New Jersey Institute of Technology

External person

Arokia Nathan

  • University of Cambridge

External person

Debdyuti Mandal

  • New Jersey Institute of Technology
  • Department of Mechanical and Industrial Engineering

External person

C. S. Huang

  • Department of Electrical and Computer Engineering
  • New Jersey Institute of Technology

External person

R. M. Sankaran

  • Case Western Reserve University

External person

S. Kishore

  • New Jersey Institute of Technology

External person

Rakesh K. Kabra

  • Sarnoff Corporation

External person

Ernest Y. Wu

  • Global Foundries, Inc.

External person

B. H. Choi

  • SEMATECH

External person

William N. Carr

  • New Jersey Institute of Technology
  • Telcordia Technologies
  • Physics and the Electrical Engineering Departments
  • Department of Physics
  • Department of Electrical and Computer Engineering

External person

Huaqiang Wu

  • Tokyo Institute of Technology

External person

P. Mascher

  • McMaster University

External person

Kuan Wei Lee

  • I-Shou University
  • Department of Electronic Engineering

External person

C. R. Selvakumar

  • University of Waterloo

External person

Yuvraj Patel

  • New Jersey Institute of Technology

External person

C. A. MacDonald

  • SUNY Albany
  • Physics Department

External person

J. T. Clemens

  • Lucent
  • Nokia

External person

Tristan Ventura

  • Rutgers - The State University of New Jersey, New Brunswick

External person

M. Rajan Philip

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering

External person

Akira Toriumi

  • The University of Tokyo

External person

Xiaodong Wang

  • New Jersey Institute of Technology
  • SUNY Albany
  • Department of Applied Physics
  • Department of Physics
  • College of Nanoscale Science and Engineering
  • Microelectronics Research Center
  • University at Albany-SUNY
  • SUNY Polytechnic Institute

External person

Lee

  • SEMATECH

External person

G. J. Leusink

  • TEL Technology Center, America, LLC
  • Tokyo Electron Limited

External person

T. Hakamata

  • TEL Technology Center, America, LLC
  • Tokyo Electron Limited

External person

Zhi Yong Li

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering

External person

Andrei Fluerasu

  • Brookhaven National Laboratory
  • Center for Functional Nanomaterials

External person

Kanzhu Guo

  • Department of Physics
  • Department of Physics, Rutgers University-Newark Campus
  • Rutgers - The State University of New Jersey, Newark
  • Department of Physics
  • Department of Applied Physics

External person

Minhee Kim

  • New Jersey Institute of Technology
  • Department of Chemistry and Environmental Science

External person

J. Opyrchal

  • New Jersey Institute of Technology
  • Department of Physics

External person

S. Ayyagari

  • New Jersey Institute of Technology

External person

Jianjun Zhen

  • Department of Physics
  • New Jersey Institute of Technology

External person

Chen Yang

  • Analog Devices, Inc.

External person

Jyothi Kasinath

  • Indian Institute of Technology Bombay
  • Center of Excellence in Nanoelectronics

External person

M. Koyanagi

  • Tohoku University

External person

Yi Li

  • Huazhong University of Science and Technology

External person

P. J. Timans

  • Eindhoven University of Technology
  • Holst Centre

External person

A. Peralta

  • New Jersey Institute of Technology

External person

Ziyan Cheng

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering

External person

Vishnu Mandava

  • New Jersey Institute of Technology
  • Department of Electrical Engineering

External person

P. Shao

  • Department of Electrical and Computer Engineering
  • New Jersey Institute of Technology

External person

D. J. Roulston

  • University of Waterloo

External person

Shiqiang Zhuang

  • New Jersey Institute of Technology
  • Department of Mechanical and Industrial Engineering
  • Department of Mechanical Engineering
  • Jinan University
  • University of Jinan

External person

T. T. Pham

  • Vietnam National University Ho Chi Minh City
  • Center for Innovative Materials and Architectures
  • Ho Chi Minh City University of Technology - HCMUT
  • Ho Chi Minh City University of Technology - HUTECH

External person

Thomas Grycewicz

  • United States Air Force Academy

External person

K. Kondo

  • Osaka Metropolitan University

External person

Revathy Padmanabhan

  • Indian Institute of Technology Palakkad

External person

W. F. Kosonocky

  • New Jersey Institute of Technology
  • Electronic Imaging Center
  • Department of Electrical and Computer Engineering

External person

Hoang Duy Nguyen

  • Vietnam Academy of Science and Technology
  • Vietnamese Academy of Science and Technology
  • Institute of Applied Materials Science
  • Vietnam National University Ho Chi Minh City

External person

J. Fenton

  • University of Central Florida

External person

Xuehai Tan

  • Department of Physics and CNBM New Energy Materials Research Center
  • New Jersey Institute of Technology
  • Department of Physics

External person

M. Sahoo

  • SUNY Albany
  • Department of Computer Science

External person

S. Madapur

  • II-VI Incorporated
  • Department of Electrical and Computer Engineering
  • New Jersey Institute of Technology

External person

Emily Lattanzio

  • High Point University

External person

R. A. Bartynski

  • Rutgers - The State University of New Jersey, New Brunswick
  • Department of Physics

External person

G. Nakamur

  • New Jersey Institute of Technology
  • TEL Technology Center, America, LLC
  • Department of Electrical and Computer Engineering
  • Tokyo Electron Limited

External person

M. Cole

  • New Jersey Institute of Technology

External person

Hei Wong

  • City University of Hong Kong
  • Department of Electronic Engineering

External person

Xinde Wang

  • Discovery Semiconductors
  • Discovery Semiconductors, Inc

External person

John Tower

  • Sarnoff Corporation

External person

Vladimir Briller

  • New Jersey Institute of Technology
  • Education Development Center
  • Vera Inst. of Justice in New York
  • International Department in New York
  • Department of Electrical Engineering

External person

Christopher Cole

  • TEL Technology Center, America, LLC
  • Tokyo Electron Limited

External person