Keyphrases
Deep Reactive Ion Etching
100%
Ultrathin
100%
Bonded Wafer
100%
Micro-electrical-mechanical Systems
85%
System Research
57%
New Jersey
42%
System Development
42%
Industrial Partner
28%
Art Process
28%
Multicrystalline Silicon
28%
Wafer Bonding
28%
Research Instrumentation
28%
Advanced Training
14%
Graduate Degree
14%
Ultra-thin Wafer
14%
Biomedical Manufacturing
14%
Process Method
14%
Profile Control
14%
Efficient Technology Transfer
14%
Prototype Development
14%
Complex Design
14%
Biomedical Engineering
14%
Engineering Materials
14%
Stevens Institute of Technology
14%
Electrical Engineering
14%
Cleanroom
14%
Free-standing Structure
14%
Deep Etching
14%
Materials Science
14%
Microfluidics
14%
Undergraduate Degree
14%
Silicon Removal
14%
Process Equipment
14%
Process Characterization
14%
Removal Rate
14%
Over 40
14%
Joint Research
14%
Undergraduate Students
14%
High Selectivity
14%
Further Development
14%
Bonding Process
14%
Optics
14%
Mechanical Engineering
14%
Centerpiece
14%
Micro-electro-mechanical Systems
14%
Guidance System
14%
Simulation Process
14%
Institutes of Technology
14%
System Application
14%
Model Simulation
14%
Etch Profile
14%
Underlying Layer
14%
Development Effort
14%
Microelectronics
14%
High Silicon
14%
Actuator
14%
Silicon Membrane
14%
Rutgers University
14%
Engineering
Deep Reactive Ion Etching
100%
Mechanical Systems
85%
Wafer Bonding
28%
Silicon Single Crystal
28%
Profile Control
14%
Simulation Process
14%
Mechanical Engineering
14%
Polycrystalline
14%
Joints (Structural Components)
14%
Removal Rate
14%
Micro-Electro-Mechanical System
14%
Electrical Engineering
14%
Guidance System
14%
Cleanroom
14%
Biomechanics
14%
Biomedical Engineering
14%
Engineering
14%
Microelectronics
14%