Acquisition of Instrumentation for Research and Development of Bonded Ultra Thin Silicon Wafers

9601937 Farmer Building on their strong research program on silicon wafer processing, micromachining, microelectromechanical systems (MEMS), electrical and optical characterization, and related areas over the past eighteen months, NJIT researchers have investigated specifically the process of bonding ultra-thin silicon wafers (as thin as 2 micrometers), a product of Virginia Semiconductor, Inc. (VSI), to virgin and oxidized silicon substrates. This work has recently culminated in a joint patent application for a bonded structure using ultra-thin silicon, and a commitment by VSI to supply ultra-thin wafers for continued research, both on the processes and mechanisms of ultra-thin wafer bonding, and on MEMS, silicon-on-insulator (SOI) and silicon-on-silicon (SOS) applications. Through the Academic Research Infrastructure Program, NJIT is seeking to expand its research efforts in ultra-thin silicon wafer bonding. ***