9361240 Dreizin From spot welding to soldering, joining metal wires to one another or to substrates is a major part of the assembly process for electrical and electronic devices. This program will develop an entirely new method for welding such joints using filler metals. In this novel method, 50-500 micrometer diameter monodisperse droplets of high temperature filler metal are generated remotely and then transported and deposited at the joint to be welded. Since there is no direct contact between the energy source and weld site, thermal or electrical damage to components is eliminated. Droplet size and temperature can be controlled so that the weld can be tailored to specific requirements. Almost any metal can serve as weld filler, including refractories. Welds of copper and aluminum wires to aluminum and silicon plates (copper or aluminum filler) and of tungsten wires to tungsten or molybdenum plates (tungsten or molybdenum filler) will be made. The weld strengths will be measured and correlated with experimental parameters such as droplet metal identity, size, and temperature. This new method for making permanent electrical and electronic connections will be useful for applications requiring high durability connections such as for printed circuit boards for use in vibrating or accelerating environments or for attaching lamp filaments to base connections. The technique could replace environmentally unsatisfactory solders in many electrical and electronic assembly processes.
|Effective start/end date||1/15/94 → 12/31/94|
- National Science Foundation: $62,560.00
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