A molecular dynamics study of the influence of atomic scale Interfaces on the Coefficient of thermal expansion of composite materials

G. Khare, N. Chandra

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Coefficient of thermal expansion (CTE) is a key property for any material system that operates under a temperature range. A composite made of two or more materials is generally used when the combination of desired properties cannot be obtained in a single material. CTE of a composite system is determined not only by the properties, distribution and orientation of individual phases forming the composite but also by the thermally induced stresses caused due to the presence of interface between the different materials. Interfaces play a key role in the determination of thermomechanical properties of the composites. In this work, we employ molecular dynamics simulations based on Morse potential to study the influence of interfacial strength on the coefficient of thermal expansion of the composites. We compare the results of atomistic simulation with the results obtained using popular continuum based models like Eshelby's model.

Original languageEnglish (US)
Title of host publicationProceedings of the 29th International Thermal Conductivity Conference, ITCC29 and the Proceedings of the 17th International Thermal Expansion Symposium, ITES17
Pages582-592
Number of pages11
StatePublished - Dec 1 2008
Externally publishedYes
Event29th International Thermal Conductivity Conference, ITCC29 and the 17th International Thermal Expansion Symposium, ITES17 - Birmingham, AL, United States
Duration: Jun 24 2007Jun 27 2007

Publication series

NameProceedings of the 29th International Thermal Conductivity Conference, ITCC29 and the Proceedings of the 17th International Thermal Expansion Symposium, ITES17

Other

Other29th International Thermal Conductivity Conference, ITCC29 and the 17th International Thermal Expansion Symposium, ITES17
CountryUnited States
CityBirmingham, AL
Period6/24/076/27/07

All Science Journal Classification (ASJC) codes

  • Industrial and Manufacturing Engineering

Fingerprint Dive into the research topics of 'A molecular dynamics study of the influence of atomic scale Interfaces on the Coefficient of thermal expansion of composite materials'. Together they form a unique fingerprint.

Cite this