TY - GEN
T1 - A molecular dynamics study of the influence of atomic scale Interfaces on the Coefficient of thermal expansion of composite materials
AU - Khare, G.
AU - Chandra, N.
PY - 2008
Y1 - 2008
N2 - Coefficient of thermal expansion (CTE) is a key property for any material system that operates under a temperature range. A composite made of two or more materials is generally used when the combination of desired properties cannot be obtained in a single material. CTE of a composite system is determined not only by the properties, distribution and orientation of individual phases forming the composite but also by the thermally induced stresses caused due to the presence of interface between the different materials. Interfaces play a key role in the determination of thermomechanical properties of the composites. In this work, we employ molecular dynamics simulations based on Morse potential to study the influence of interfacial strength on the coefficient of thermal expansion of the composites. We compare the results of atomistic simulation with the results obtained using popular continuum based models like Eshelby's model.
AB - Coefficient of thermal expansion (CTE) is a key property for any material system that operates under a temperature range. A composite made of two or more materials is generally used when the combination of desired properties cannot be obtained in a single material. CTE of a composite system is determined not only by the properties, distribution and orientation of individual phases forming the composite but also by the thermally induced stresses caused due to the presence of interface between the different materials. Interfaces play a key role in the determination of thermomechanical properties of the composites. In this work, we employ molecular dynamics simulations based on Morse potential to study the influence of interfacial strength on the coefficient of thermal expansion of the composites. We compare the results of atomistic simulation with the results obtained using popular continuum based models like Eshelby's model.
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M3 - Conference contribution
AN - SCOPUS:62949193507
SN - 9781932078725
T3 - Proceedings of the 29th International Thermal Conductivity Conference, ITCC29 and the Proceedings of the 17th International Thermal Expansion Symposium, ITES17
SP - 582
EP - 592
BT - Proceedings of the 29th International Thermal Conductivity Conference, ITCC29 and the Proceedings of the 17th International Thermal Expansion Symposium, ITES17
T2 - 29th International Thermal Conductivity Conference, ITCC29 and the 17th International Thermal Expansion Symposium, ITES17
Y2 - 24 June 2007 through 27 June 2007
ER -