A new method of determining the stress state in microelectronic materials

Hancheng Liang, Shounan Zhao, K. Ken Chin

Research output: Contribution to journalArticlepeer-review

11 Scopus citations

Abstract

This paper introduces a new technique of determining the stress in microelectronic materials by combining photoelasticity and Fourier analysis. The approach uses a continuously rotating analyser to determine the photoelastic parameters from a Fourier analysis of the measured emerging light intensity. The principle of operation is discussed and the apparatus is described. An example is demonstrated to illustrate the application of the technique.

Original languageEnglish (US)
Pages (from-to)102-105
Number of pages4
JournalMeasurement Science and Technology
Volume7
Issue number1
DOIs
StatePublished - Jan 1996

All Science Journal Classification (ASJC) codes

  • Instrumentation
  • Engineering (miscellaneous)
  • Applied Mathematics

Fingerprint Dive into the research topics of 'A new method of determining the stress state in microelectronic materials'. Together they form a unique fingerprint.

Cite this