Aluminum films prepared by metal-organic low pressure chemical vapor deposition

Engineering & Materials Science

• Low pressure chemical vapor deposition 100%
• Aluminum 47%
• Metals 39%
• Vapors 15%
• Silicon wafers 10%
• Metallizing 10%
• Transmission electron microscopy 8%
• Deposits 8%
• Pyrolysis 8%
• Chemical activation 7%
• Surface roughness 7%
• Textures 7%
• Substrates 6%
• Fibers 5%
• Temperature 3%

Physics & Astronomy

• low pressure 51%
• vapor deposition 47%
• aluminum 42%
• metals 31%
• vapors 13%
• pyrolysis 8%
• deposits 7%
• surface roughness 7%
• examination 7%
• textures 7%
• activation 6%
• wafers 6%
• reflectance 6%
• transmission electron microscopy 5%
• electrical resistivity 5%
• fibers 4%
• silicon 4%
• temperature 2%

Chemical Compounds

• Low Pressure Chemical Vapour Deposition 89%
• Liquid Film 29%
• Surface Roughness 8%
• Pyrolysis 6%
• Transmission Electron Microscopy 5%
• Fiber 5%
• Purity 4%
• Surface 2%