Keyphrases
Innovative Process
100%
Diamond
100%
Thermal Management Applications
100%
Diamond Composite Films
100%
Diamond-copper Composites
100%
Hot Pressing
60%
Thermal Conductivity
40%
Copper Matrix
40%
Composite Film
40%
Coefficient of Thermal Expansion
40%
Carbides
40%
Cm(III)
40%
K(I)
40%
Interfacial Bonding
40%
Tape Casting
40%
Cost-effectiveness
20%
Scanning Electron Microscopy
20%
Heat Transfer
20%
High Thermal Performance
20%
Thermal Management
20%
Volume Fraction
20%
Submicron Particles
20%
Surface Finish
20%
Particle Deposition
20%
Smooth Surface
20%
Pure Copper
20%
Thickness Control
20%
Chemical Bonding
20%
Densification
20%
Finishing Materials
20%
Copper Particles
20%
Spreading Layer
20%
Heat Spreading
20%
Power Electronic Module
20%
Laminated Materials
20%
Bonding Agent
20%
Net Shaping
20%
Microstructural Study
20%
Material Science
Composite Films
100%
Diamond
100%
Hot Pressing
50%
Thermal Conductivity
33%
Thermal Expansion
33%
Carbide
33%
Tape Casting
33%
Film
16%
Density
16%
Laminate
16%
Scanning Electron Microscopy
16%
Chemical Bonding
16%
Volume Fraction
16%