Assessing product design alternatives with respect to environmental performance and sustainability: A case study for circuit pack faceplates

J. Mosovsky, J. Dispenza, D. Dickinson, J. Morabito, R. Caudill, N. Alli

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Scopus citations

Abstract

Working in partnership, Lucent Technologies and the NJIT Multi-Lifecycle Engineering Research Center conducted an evaluation on two different circuit pack faceplate designs. Pro/Engineer files representing a proposed "two-shot" molded thermoplastic faceplate and a current metal (aluminum) assembly design were evaluated using NJIT benefits of the proposed design as well as the advantages of using this approach to evaluate alternative designs, construction, processes and materials. By integrating environmental LCA and EcoPro into product design systems, efforts to extend Design for (X) metrics to include the environment were formalized in a strategy that gives designers timely feedback on the lifecycle impact of an evolving design.

Original languageEnglish (US)
Title of host publicationIEEE International Symposium on Electronics and the Environment
Pages252-257
Number of pages6
StatePublished - Jan 1 2001
Event2001 IEEE International Symposium on Electronics and the Environment - Denver, CA, United States
Duration: May 7 2001May 9 2001

Other

Other2001 IEEE International Symposium on Electronics and the Environment
CountryUnited States
CityDenver, CA
Period5/7/015/9/01

All Science Journal Classification (ASJC) codes

  • Environmental Engineering
  • Waste Management and Disposal
  • Electrical and Electronic Engineering

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