Assessing product design alternatives with respect to environmental performance and sustainability: A case study for circuit pack faceplates

J. Mosovsky; J. Dispenza; D. Dickinson; J. Morabito; R. Caudill; N. Alli

Assessing product design alternatives with respect to environmental performance and sustainability: A case study for circuit pack faceplates

J. Mosovsky, J. Dispenza, D. Dickinson, J. Morabito, R. Caudill, N. Alli

Research output: Contribution to conference › Paper › peer-review

Abstract

Working in partnership, Lucent Technologies and the NJIT Multi-Lifecycle Engineering Research Center conducted an evaluation on two different circuit pack faceplate designs. Pro/Engineer files representing a proposed "two-shot" molded thermoplastic faceplate and a current metal (aluminum) assembly design were evaluated using NJIT benefits of the proposed design as well as the advantages of using this approach to evaluate alternative designs, construction, processes and materials. By integrating environmental LCA and EcoPro into product design systems, efforts to extend Design for (X) metrics to include the environment were formalized in a strategy that gives designers timely feedback on the lifecycle impact of an evolving design.

Original language	English (US)
Pages	252-257
Number of pages	6
State	Published - 2001
Event	2001 IEEE International Symposium on Electronics and the Environment - Denver, CA, United States Duration: May 7 2001 → May 9 2001

Other

Other	2001 IEEE International Symposium on Electronics and the Environment
Country/Territory	United States
City	Denver, CA
Period	5/7/01 → 5/9/01

All Science Journal Classification (ASJC) codes

Environmental Engineering
Waste Management and Disposal
Pollution
Electrical and Electronic Engineering

Cite this

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abstract = "Working in partnership, Lucent Technologies and the NJIT Multi-Lifecycle Engineering Research Center conducted an evaluation on two different circuit pack faceplate designs. Pro/Engineer files representing a proposed {"}two-shot{"} molded thermoplastic faceplate and a current metal (aluminum) assembly design were evaluated using NJIT benefits of the proposed design as well as the advantages of using this approach to evaluate alternative designs, construction, processes and materials. By integrating environmental LCA and EcoPro into product design systems, efforts to extend Design for (X) metrics to include the environment were formalized in a strategy that gives designers timely feedback on the lifecycle impact of an evolving design.",

author = "J. Mosovsky and J. Dispenza and D. Dickinson and J. Morabito and R. Caudill and N. Alli",

year = "2001",

language = "English (US)",

pages = "252--257",

note = "2001 IEEE International Symposium on Electronics and the Environment ; Conference date: 07-05-2001 Through 09-05-2001",

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Assessing product design alternatives with respect to environmental performance and sustainability: A case study for circuit pack faceplates. / Mosovsky, J.; Dispenza, J.; Dickinson, D. et al.
2001. 252-257 Paper presented at 2001 IEEE International Symposium on Electronics and the Environment, Denver, CA, United States.

Research output: Contribution to conference › Paper › peer-review

TY - CONF

T1 - Assessing product design alternatives with respect to environmental performance and sustainability

T2 - 2001 IEEE International Symposium on Electronics and the Environment

AU - Mosovsky, J.

AU - Dispenza, J.

AU - Dickinson, D.

AU - Morabito, J.

AU - Caudill, R.

AU - Alli, N.

PY - 2001

Y1 - 2001

N2 - Working in partnership, Lucent Technologies and the NJIT Multi-Lifecycle Engineering Research Center conducted an evaluation on two different circuit pack faceplate designs. Pro/Engineer files representing a proposed "two-shot" molded thermoplastic faceplate and a current metal (aluminum) assembly design were evaluated using NJIT benefits of the proposed design as well as the advantages of using this approach to evaluate alternative designs, construction, processes and materials. By integrating environmental LCA and EcoPro into product design systems, efforts to extend Design for (X) metrics to include the environment were formalized in a strategy that gives designers timely feedback on the lifecycle impact of an evolving design.

AB - Working in partnership, Lucent Technologies and the NJIT Multi-Lifecycle Engineering Research Center conducted an evaluation on two different circuit pack faceplate designs. Pro/Engineer files representing a proposed "two-shot" molded thermoplastic faceplate and a current metal (aluminum) assembly design were evaluated using NJIT benefits of the proposed design as well as the advantages of using this approach to evaluate alternative designs, construction, processes and materials. By integrating environmental LCA and EcoPro into product design systems, efforts to extend Design for (X) metrics to include the environment were formalized in a strategy that gives designers timely feedback on the lifecycle impact of an evolving design.

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SP - 252

EP - 257

Y2 - 7 May 2001 through 9 May 2001

ER -

Assessing product design alternatives with respect to environmental performance and sustainability: A case study for circuit pack faceplates

Abstract

Other

All Science Journal Classification (ASJC) codes

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