Broadband time-domain characterization of multiple flip-chip interconnects

Peter Li, Hui Wu, Tong Li, Ken Chin, Wenquan Sui

Research output: Contribution to journalArticlepeer-review

Abstract

This paper presents a comprehensive approach for the characterization of multiple flip-chip interconnects by three-dimensional finite-difference time-domain (FDTD) method. The behaviors of transition discontinuities in three coplanar waveguide (CPW) layers and four flip-chip bump interconnects are investigated for optimal packaging performance. The relationship between the reflection loss and the cross-section of bumps is discussed in detail. Results in this paper shows that FDTD is a reliable method to simulate and aid design of complicated package structures.

Original languageEnglish (US)
Pages (from-to)1891-1894
Number of pages4
JournalIEEE MTT-S International Microwave Symposium Digest
Volume1
DOIs
StatePublished - 2001

All Science Journal Classification (ASJC) codes

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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