This paper presents a comprehensive approach for the characterization of multiple flip-chip interconnects by three-dimensional finite-difference time-domain (FDTD) method. The behaviors of transition discontinuities in three coplanar waveguide (CPW) layers and four flip-chip bump interconnects are investigated for optimal packaging performance. The relationship between the reflection loss and the cross-section of bumps is discussed in detail. Results in this paper shows that FDTD is a reliable method to simulate and aid design of complicated package structures.
|Original language||English (US)|
|Number of pages||4|
|Journal||IEEE MTT-S International Microwave Symposium Digest|
|State||Published - 2001|
All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
- Electrical and Electronic Engineering