Broadband time-domain characterization of multiple flip-chip interconnects

Peter Li; Hui Wu; Tong Li; Ken Chin; Wenquan Sui

doi:10.1109/MWSYM.2001.967277

Broadband time-domain characterization of multiple flip-chip interconnects

Peter Li, Hui Wu, Tong Li, Ken Chin, Wenquan Sui

Research output: Contribution to journal › Article › peer-review

Abstract

This paper presents a comprehensive approach for the characterization of multiple flip-chip interconnects by three-dimensional finite-difference time-domain (FDTD) method. The behaviors of transition discontinuities in three coplanar waveguide (CPW) layers and four flip-chip bump interconnects are investigated for optimal packaging performance. The relationship between the reflection loss and the cross-section of bumps is discussed in detail. Results in this paper shows that FDTD is a reliable method to simulate and aid design of complicated package structures.

Original language	English (US)
Pages (from-to)	1891-1894
Number of pages	4
Journal	IEEE MTT-S International Microwave Symposium Digest
Volume	1
DOIs	https://doi.org/10.1109/MWSYM.2001.967277
State	Published - 2001

All Science Journal Classification (ASJC) codes

Radiation
Condensed Matter Physics
Electrical and Electronic Engineering

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10.1109/MWSYM.2001.967277

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abstract = "This paper presents a comprehensive approach for the characterization of multiple flip-chip interconnects by three-dimensional finite-difference time-domain (FDTD) method. The behaviors of transition discontinuities in three coplanar waveguide (CPW) layers and four flip-chip bump interconnects are investigated for optimal packaging performance. The relationship between the reflection loss and the cross-section of bumps is discussed in detail. Results in this paper shows that FDTD is a reliable method to simulate and aid design of complicated package structures.",

author = "Peter Li and Hui Wu and Tong Li and Ken Chin and Wenquan Sui",

year = "2001",

doi = "10.1109/MWSYM.2001.967277",

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AU - Li, Peter

AU - Wu, Hui

AU - Li, Tong

AU - Chin, Ken

AU - Sui, Wenquan

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AB - This paper presents a comprehensive approach for the characterization of multiple flip-chip interconnects by three-dimensional finite-difference time-domain (FDTD) method. The behaviors of transition discontinuities in three coplanar waveguide (CPW) layers and four flip-chip bump interconnects are investigated for optimal packaging performance. The relationship between the reflection loss and the cross-section of bumps is discussed in detail. Results in this paper shows that FDTD is a reliable method to simulate and aid design of complicated package structures.

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JO - IEEE MTT-S International Microwave Symposium Digest

JF - IEEE MTT-S International Microwave Symposium Digest

ER -

Broadband time-domain characterization of multiple flip-chip interconnects

Abstract

All Science Journal Classification (ASJC) codes

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