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Broadband time-domain characterization of multiple flip-chip interconnects
Peter Li
, Hui Wu
, Tong Li
,
Ken Chin
, Wenquan Sui
CNBM New Energy Materials Research Center
Physics
Research output
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Keyphrases
Flip-chip Interconnect
100%
Time-domain Characterization
100%
Comprehensive Approach
50%
Reflection Loss
50%
Finite-difference Time-domain
50%
Three-dimensional Finite-difference Time-domain
50%
Finite-difference Time-domain Method
50%
Package Structure
50%
Flip chip
50%
Waveguide Layer
50%
Optimal Packaging
50%
Packaging Performance
50%
Coplanar Waveguide
50%
Physics
Finite Difference Method
100%
Waveguide
100%
Finite Difference Time Domain Method
100%
Computer Science
Finite-Difference Time-Domain Method
100%
Package Structure
50%
coplanar waveguide
50%
Finite-Difference Time-Domain (FDTD)
50%