Characterization Of Lpcvd Aluminum For Vlsi Processing

Keyphrases

• Low Pressure Chemical Vapor Deposition (LPCVD) 100%
• Step Coverage 100%
• Vlsi 100%
• Device Performance 50%
• Adhesion 50%
• Electrical Conductivity 50%
• Wafer 50%
• Surface States 50%
• Metallized 50%
• Interdiffusion 50%
• Aluminum Alloy 50%
• Chemical Vapor Deposition Processes 50%
• Dry Etching 50%
• Aluminum Film 50%
• Device Wafer 50%
• Electromigration Resistance 50%
• Al-Si 50%
• Bonding Ability 50%
• Chemical Purity 50%

Material Science

• Aluminum 100%
• Film 40%
• Low Pressure Chemical Vapor Deposition 40%
• Silicon 20%
• Electrical Resistivity 20%
• Vapor Phase Deposition 20%
• Aluminum Alloys 20%
• Dry Etching 20%
• Metallization 20%