Skip to main navigation
Skip to search
Skip to main content
New Jersey Institute of Technology Home
Help & FAQ
Home
Profiles
Research units
Facilities
Federal Grants
Research output
Press/Media
Search by expertise, name or affiliation
Chemical Vapor Deposition of Metals for Integrated Circuit Applications
M. L. Green,
R. A. Levy
Research output
:
Contribution to journal
›
Article
›
peer-review
25
Scopus citations
Overview
Fingerprint
Fingerprint
Dive into the research topics of 'Chemical Vapor Deposition of Metals for Integrated Circuit Applications'. Together they form a unique fingerprint.
Sort by
Weight
Alphabetically
Keyphrases
Chemical Vapor Deposition
100%
Circuit Application
100%
CVD Technology
50%
Damage-free
50%
Deposition Process
50%
Film Formation
50%
High Purity
50%
Insulator Film
50%
Integrated Circuit Industry
50%
Integrated Circuits
100%
Low Radiation
50%
Low Temperature Damage
50%
Material Requirements
50%
Metal Cans
50%
Metal Deposition
100%
Metal Film Deposition
50%
Metal Technology
50%
Metallization
50%
Radiation Damage
50%
Semiconductor Films
50%
Engineering
Chemical Vapor Deposition
100%
Deposition Process
16%
Integrated Circuit
100%
Low-Temperature
16%
Metallizations
16%
Radiation Effect
16%
Vapor Deposition
100%
Material Science
Chemical Vapor Deposition
100%
Electronic Circuit
100%
Film
33%
Film Deposition
16%
Film Growth
16%
Metal Film
16%
Metals Application
16%
Radiation Damage
16%
Chemical Engineering
Chemical Vapor Deposition
100%
Metallizing
16%
Vapor Deposition
100%