TY - GEN
T1 - Controller design and optimal tuning of a wafer handling robot
AU - Yu, Xiaowen
AU - Wang, Cong
AU - Zhao, Yu
AU - Tomizuka, Masayoshi
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/10/7
Y1 - 2015/10/7
N2 - Frog-leg robots have been widely used for handling silicon wafers inside the vacuum environment of semiconductor manufacturing machines. In order to enhance stiffness, frog-leg robots adopt a parallel structure. A main challenge of controlling wafer handling robot is avoiding vibration, which is the major cause of wafer sliding and particle contamination. This paper presents two control approaches to improve the performance of frog-leg robots. First, in addition to the basic tri-loop PID feedback controller, torque offset is injected to the input of the robot to compensate the robot's nonlinear dynamics. This reduces the following error and major vibration. The torque offset is calculated based on identified robot dynamics. Second, a test based optimization method is developed to tune the gains of the feedback controller. Wafer vibration is measured and analyzed to score the system performance. Comparison results show that the proposed control scheme gives much improved performance.
AB - Frog-leg robots have been widely used for handling silicon wafers inside the vacuum environment of semiconductor manufacturing machines. In order to enhance stiffness, frog-leg robots adopt a parallel structure. A main challenge of controlling wafer handling robot is avoiding vibration, which is the major cause of wafer sliding and particle contamination. This paper presents two control approaches to improve the performance of frog-leg robots. First, in addition to the basic tri-loop PID feedback controller, torque offset is injected to the input of the robot to compensate the robot's nonlinear dynamics. This reduces the following error and major vibration. The torque offset is calculated based on identified robot dynamics. Second, a test based optimization method is developed to tune the gains of the feedback controller. Wafer vibration is measured and analyzed to score the system performance. Comparison results show that the proposed control scheme gives much improved performance.
UR - http://www.scopus.com/inward/record.url?scp=84952781800&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84952781800&partnerID=8YFLogxK
U2 - 10.1109/CoASE.2015.7294150
DO - 10.1109/CoASE.2015.7294150
M3 - Conference contribution
AN - SCOPUS:84952781800
T3 - IEEE International Conference on Automation Science and Engineering
SP - 640
EP - 646
BT - 2015 IEEE Conference on Automation Science and Engineering
PB - IEEE Computer Society
T2 - 11th IEEE International Conference on Automation Science and Engineering, CASE 2015
Y2 - 24 August 2015 through 28 August 2015
ER -