@inproceedings{a56b97db176146aa90d2761328123401,
title = "Cyclic thin film flexible pressure sensor testing",
abstract = "The observed test results suggest that the flexible strain sensor could endure a large number of repetitive bending cycles, i.e. 6×106 before failing. The deterioration might be due to cracks formation on the piezo-resistance semiconductor layers, delamination of the thin film layers and conduction metal. Care has been taken to ensure that the device failure is not due to the connection wire popping off from the sensor and soldering induced fault.",
author = "Lim, {Hee C.} and Zunino, {James L.} and Federici, {John F.}",
year = "2007",
doi = "10.1117/12.704223",
language = "English (US)",
isbn = "0819465763",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
booktitle = "Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI",
note = "Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI ; Conference date: 23-01-2007 Through 24-01-2007",
}