Cyclic thin film flexible pressure sensor testing

Hee C. Lim, James L. Zunino, John Federici

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The observed test results suggest that the flexible strain sensor could endure a large number of repetitive bending cycles, i.e. 6×106 before failing. The deterioration might be due to cracks formation on the piezo-resistance semiconductor layers, delamination of the thin film layers and conduction metal. Care has been taken to ensure that the device failure is not due to the connection wire popping off from the sensor and soldering induced fault.

Original languageEnglish (US)
Title of host publicationReliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI
DOIs
StatePublished - Apr 30 2007
EventReliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI - San Jose, CA, United States
Duration: Jan 23 2007Jan 24 2007

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume6463
ISSN (Print)0277-786X

Other

OtherReliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI
CountryUnited States
CitySan Jose, CA
Period1/23/071/24/07

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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