Abstract
The accurate placement of surface-mount components on their respective pads is an important problem in surface-mount technology. As the lead/pad pitch size decreases, the placement problem becomes more difficult and a vision system is required to provide error information necessary to implement an accurate placement. Most vision-based placement strategies described in the open literature use component-topad alignment techniques unable to compensate for local errors in the component or the pad. This paper describes the development of a lead-to-pad placement strategy able to compensate for global and local errors. Sharp images with good illumination techniques reduce the amount of image processing, and simulation results show that lead-to-pad matching performs significantly better than component-to-pad matching.
Original language | English (US) |
---|---|
Pages (from-to) | 855-864 |
Number of pages | 10 |
Journal | IIE Transactions (Institute of Industrial Engineers) |
Volume | 28 |
Issue number | 10 |
DOIs | |
State | Published - 1996 |
Externally published | Yes |
All Science Journal Classification (ASJC) codes
- Industrial and Manufacturing Engineering