Development of a new generation polyamideimide (PAI)

P. N. Chen, R. H. Vora, M. M. Glick, M. J. Jaffe

Research output: Contribution to journalConference articlepeer-review

1 Scopus citations

Abstract

This paper describes the synthesis, characterization and development of heat stable polyamideimide (PAI) polymers. The polymers are generally prepared by forming the polycondensation product of an aromatic diamine, a trifunctional aromatic anhydride acid chloride and an aromatic dianhydride containing trifluoromethyl moieties. These new materials possess high glass transition temperatures, useful mechanical properties and outstanding thermoplastic flow behavior which render them melt processable into fibers, films, sheets and other molded articles. The as-precipitated fluoro-containing PAI materials exhibit solubility in many organic solvents and are thus amenable to solution casting techniques. They also show excellent resistance towards thermooxidative degradation at temperatures to 450°F and low moisture uptake. The mechanical properties of the 10% 6F-PAI films were 14.8 ksi tensile strength, 0.40 msi tensile modulus and 7.9% elongation.

Original languageEnglish (US)
Pages (from-to)755-766
Number of pages12
JournalNational SAMPE Technical Conference
Volume21
StatePublished - Dec 1 1989
Externally publishedYes
Event21st International SAMPE Technical Conference - Atlantic City, NJ, USA
Duration: Sep 25 1989Sep 28 1989

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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