Dynamics modeling and identification of a dual-blade wafer handling robot

Xiaowen Yu; Cong Wang; Yu Zhao; Masayoshi Tomizuka

doi:10.1115/DSCC2013-3896

Dynamics modeling and identification of a dual-blade wafer handling robot

Xiaowen Yu, Cong Wang, Yu Zhao, Masayoshi Tomizuka

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Scopus citations

Abstract

This paper presents the dynamics modeling and dynamic identification of a dual-blade wafer handling robot. An explicit form dynamic model for this 8-link parallel robot is proposed. The dynamic model is transformed into a decoupled form to enable dynamic parameters identification with least-square regression. A well conditioned trajectory is chosen for identification experiment. Both viscous friction and Coulomb friction are considered to make the model more reliable. Model has been validated by experiments.

Original language	English (US)
Title of host publication	Nonlinear Estimation and Control; Optimization and Optimal Control; Piezoelectric Actuation and Nanoscale Control; Robotics and Manipulators; Sensing;
Publisher	American Society of Mechanical Engineers (ASME)
ISBN (Print)	9780791856147
DOIs	https://doi.org/10.1115/DSCC2013-3896
State	Published - 2013
Externally published	Yes
Event	ASME 2013 Dynamic Systems and Control Conference, DSCC 2013 - Palo Alto, CA, United States Duration: Oct 21 2013 → Oct 23 2013

Publication series

Name	ASME 2013 Dynamic Systems and Control Conference, DSCC 2013
Volume	3

Other

Other	ASME 2013 Dynamic Systems and Control Conference, DSCC 2013
Country/Territory	United States
City	Palo Alto, CA
Period	10/21/13 → 10/23/13

All Science Journal Classification (ASJC) codes

Control and Systems Engineering

Access to Document

10.1115/DSCC2013-3896

Cite this

Yu, X., Wang, C., Zhao, Y., & Tomizuka, M. (2013). Dynamics modeling and identification of a dual-blade wafer handling robot. In Nonlinear Estimation and Control; Optimization and Optimal Control; Piezoelectric Actuation and Nanoscale Control; Robotics and Manipulators; Sensing; Article V003T39A004 (ASME 2013 Dynamic Systems and Control Conference, DSCC 2013; Vol. 3). American Society of Mechanical Engineers (ASME). https://doi.org/10.1115/DSCC2013-3896

Yu, Xiaowen ; Wang, Cong ; Zhao, Yu et al. / Dynamics modeling and identification of a dual-blade wafer handling robot. Nonlinear Estimation and Control; Optimization and Optimal Control; Piezoelectric Actuation and Nanoscale Control; Robotics and Manipulators; Sensing;. American Society of Mechanical Engineers (ASME), 2013. (ASME 2013 Dynamic Systems and Control Conference, DSCC 2013).

@inproceedings{e94eccb62b584a539222ade2af165d42,

title = "Dynamics modeling and identification of a dual-blade wafer handling robot",

abstract = "This paper presents the dynamics modeling and dynamic identification of a dual-blade wafer handling robot. An explicit form dynamic model for this 8-link parallel robot is proposed. The dynamic model is transformed into a decoupled form to enable dynamic parameters identification with least-square regression. A well conditioned trajectory is chosen for identification experiment. Both viscous friction and Coulomb friction are considered to make the model more reliable. Model has been validated by experiments.",

author = "Xiaowen Yu and Cong Wang and Yu Zhao and Masayoshi Tomizuka",

year = "2013",

doi = "10.1115/DSCC2013-3896",

language = "English (US)",

isbn = "9780791856147",

series = "ASME 2013 Dynamic Systems and Control Conference, DSCC 2013",

publisher = "American Society of Mechanical Engineers (ASME)",

booktitle = "Nonlinear Estimation and Control; Optimization and Optimal Control; Piezoelectric Actuation and Nanoscale Control; Robotics and Manipulators; Sensing;",

note = "ASME 2013 Dynamic Systems and Control Conference, DSCC 2013 ; Conference date: 21-10-2013 Through 23-10-2013",

}

Yu, X, Wang, C, Zhao, Y & Tomizuka, M 2013, Dynamics modeling and identification of a dual-blade wafer handling robot. in Nonlinear Estimation and Control; Optimization and Optimal Control; Piezoelectric Actuation and Nanoscale Control; Robotics and Manipulators; Sensing;., V003T39A004, ASME 2013 Dynamic Systems and Control Conference, DSCC 2013, vol. 3, American Society of Mechanical Engineers (ASME), ASME 2013 Dynamic Systems and Control Conference, DSCC 2013, Palo Alto, CA, United States, 10/21/13. https://doi.org/10.1115/DSCC2013-3896

Dynamics modeling and identification of a dual-blade wafer handling robot. / Yu, Xiaowen; Wang, Cong; Zhao, Yu et al.
Nonlinear Estimation and Control; Optimization and Optimal Control; Piezoelectric Actuation and Nanoscale Control; Robotics and Manipulators; Sensing;. American Society of Mechanical Engineers (ASME), 2013. V003T39A004 (ASME 2013 Dynamic Systems and Control Conference, DSCC 2013; Vol. 3).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Dynamics modeling and identification of a dual-blade wafer handling robot

AU - Yu, Xiaowen

AU - Wang, Cong

AU - Zhao, Yu

AU - Tomizuka, Masayoshi

PY - 2013

Y1 - 2013

N2 - This paper presents the dynamics modeling and dynamic identification of a dual-blade wafer handling robot. An explicit form dynamic model for this 8-link parallel robot is proposed. The dynamic model is transformed into a decoupled form to enable dynamic parameters identification with least-square regression. A well conditioned trajectory is chosen for identification experiment. Both viscous friction and Coulomb friction are considered to make the model more reliable. Model has been validated by experiments.

AB - This paper presents the dynamics modeling and dynamic identification of a dual-blade wafer handling robot. An explicit form dynamic model for this 8-link parallel robot is proposed. The dynamic model is transformed into a decoupled form to enable dynamic parameters identification with least-square regression. A well conditioned trajectory is chosen for identification experiment. Both viscous friction and Coulomb friction are considered to make the model more reliable. Model has been validated by experiments.

UR - http://www.scopus.com/inward/record.url?scp=84902377766&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84902377766&partnerID=8YFLogxK

U2 - 10.1115/DSCC2013-3896

DO - 10.1115/DSCC2013-3896

M3 - Conference contribution

AN - SCOPUS:84902377766

SN - 9780791856147

T3 - ASME 2013 Dynamic Systems and Control Conference, DSCC 2013

BT - Nonlinear Estimation and Control; Optimization and Optimal Control; Piezoelectric Actuation and Nanoscale Control; Robotics and Manipulators; Sensing;

PB - American Society of Mechanical Engineers (ASME)

T2 - ASME 2013 Dynamic Systems and Control Conference, DSCC 2013

Y2 - 21 October 2013 through 23 October 2013

ER -

Yu X, Wang C, Zhao Y, Tomizuka M. Dynamics modeling and identification of a dual-blade wafer handling robot. In Nonlinear Estimation and Control; Optimization and Optimal Control; Piezoelectric Actuation and Nanoscale Control; Robotics and Manipulators; Sensing;. American Society of Mechanical Engineers (ASME). 2013. V003T39A004. (ASME 2013 Dynamic Systems and Control Conference, DSCC 2013). doi: 10.1115/DSCC2013-3896

Dynamics modeling and identification of a dual-blade wafer handling robot

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