Dynamics modeling and identification of a dual-blade wafer handling robot

Xiaowen Yu, Cong Wang, Yu Zhao, Masayoshi Tomizuka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

This paper presents the dynamics modeling and dynamic identification of a dual-blade wafer handling robot. An explicit form dynamic model for this 8-link parallel robot is proposed. The dynamic model is transformed into a decoupled form to enable dynamic parameters identification with least-square regression. A well conditioned trajectory is chosen for identification experiment. Both viscous friction and Coulomb friction are considered to make the model more reliable. Model has been validated by experiments.

Original languageEnglish (US)
Title of host publicationNonlinear Estimation and Control; Optimization and Optimal Control; Piezoelectric Actuation and Nanoscale Control; Robotics and Manipulators; Sensing;
PublisherAmerican Society of Mechanical Engineers (ASME)
ISBN (Print)9780791856147
DOIs
StatePublished - Jan 1 2013
Externally publishedYes
EventASME 2013 Dynamic Systems and Control Conference, DSCC 2013 - Palo Alto, CA, United States
Duration: Oct 21 2013Oct 23 2013

Publication series

NameASME 2013 Dynamic Systems and Control Conference, DSCC 2013
Volume3

Other

OtherASME 2013 Dynamic Systems and Control Conference, DSCC 2013
CountryUnited States
CityPalo Alto, CA
Period10/21/1310/23/13

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering

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