ECS Transactions: Preface

K. Kondo; R. N. Akolkar; D. Misra; F. Roozeboom; M. Koyanagi

ECS Transactions: Preface

K. Kondo, R. N. Akolkar, D. Misra, F. Roozeboom, M. Koyanagi

Electrical and Computer Engineering

Research output: Contribution to journal › Editorial › peer-review

Original language	English (US)
Pages (from-to)	iii
Journal	ECS Transactions
Volume	41
Issue number	43
State	Published - 2012
Event	Processing Materials of 3D Interconnects, Damascene and Electronics Packaging - 220th ECS Meeting - Boston, MA, United States Duration: Oct 9 2011 → Oct 14 2011

All Science Journal Classification (ASJC) codes

General Engineering

Cite this

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title = "ECS Transactions: Preface",

author = "K. Kondo and Akolkar, {R. N.} and D. Misra and F. Roozeboom and M. Koyanagi",

year = "2012",

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journal = "ECS Transactions",

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TY - JOUR

T1 - ECS Transactions

T2 - Processing Materials of 3D Interconnects, Damascene and Electronics Packaging - 220th ECS Meeting

AU - Kondo, K.

AU - Akolkar, R. N.

AU - Misra, D.

AU - Roozeboom, F.

AU - Koyanagi, M.

PY - 2012

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M3 - Editorial

AN - SCOPUS:84879329437

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SP - iii

JO - ECS Transactions

JF - ECS Transactions

IS - 43

Y2 - 9 October 2011 through 14 October 2011

ER -

ECS Transactions: Preface

All Science Journal Classification (ASJC) codes

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Cite this