| Original language | English (US) |
|---|---|
| Pages (from-to) | iii |
| Journal | ECS Transactions |
| Volume | 41 |
| Issue number | 43 |
| State | Published - 2012 |
| Event | Processing Materials of 3D Interconnects, Damascene and Electronics Packaging - 220th ECS Meeting - Boston, MA, United States Duration: Oct 9 2011 → Oct 14 2011 |
All Science Journal Classification (ASJC) codes
- General Engineering