Effect of geometry on the fracture behavior of lead-free solder joints

Keyphrases

• Fracture Behavior 100%
• Lead-free Solder Joints 100%
• Solder Layer 100%
• Geometry Effect 100%
• Layer Thickness 66%
• Copper Bar 66%
• Strain Energy Release Rate 66%
• Moderatio 66%
• Steady State 33%
• Surface Mounting 33%
• Loading Conditions 33%
• Loading Rate 33%
• Processing Conditions 33%
• Double Cantilever Beam Specimen 33%
• Substrate Stiffness 33%
• Crack Growth 33%
• Mixed Mode Loading 33%
• Lead-free 33%
• Crack Path 33%
• Maximum Principal Stress 33%
• Cu Alloy 33%
• Von Mises Stress 33%

Engineering

• Joints (Structural Components) 100%
• Fracture Behavior 100%
• Layer Thickness 100%
• Free Solder 100%
• Strain-Energy Release Rate 100%
• Mode Ratio 100%
• Thin Layer 50%
• Loading Condition 50%
• Loading Rate 50%
• Double-Cantilever Beam 50%
• Beam Specimen 50%
• Processing Condition 50%
• Mixed Mode 50%
• Crack Growth 50%
• Crack Path 50%
• Maximum Principal Stress 50%