Effect of temperature on the fracture behavior of Cu/SAC305/Cu solder joints

Patrick B. Thompson, Richard Johnson, Siva P.V. Nadimpalli

Research output: Contribution to journalArticlepeer-review

8 Scopus citations

Abstract

Double cantilever beam (DCB) specimens consisting of Sn96.5Ag3.0Cu0.5 (SAC305) solder sandwiched between two copper bars were fabricated under standard surface mount processing conditions. Mode-I fracture tests were performed on the DCB specimens under various temperatures. The load–displacement behavior and critical loads corresponding to crack initiation were recorded and used in a finite element model of the DCB to evaluate critical energy release rates. Fracture surfaces were analyzed to understand the effect of temperature on crack path and fracture mechanism. The critical energy release rate decreased from 603 at −50 °C to 93 J/m2 at 100 °C and the crack path shifted from solder/intermetallic compound interface to bulk solder.

Original languageEnglish (US)
Pages (from-to)730-738
Number of pages9
JournalEngineering Fracture Mechanics
Volume199
DOIs
StatePublished - Aug 2018

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Keywords

  • Interface fracture
  • Intermetallics
  • J-integral
  • Lead-free solder
  • SAC305 fracture
  • Temperature effect

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