Effect of temperature on the fracture behavior of Cu/SAC305/Cu solder joints

Patrick B. Thompson; Richard Johnson; Siva P.V. Nadimpalli

doi:10.1016/j.engfracmech.2018.07.004

Effect of temperature on the fracture behavior of Cu/SAC305/Cu solder joints

Patrick B. Thompson, Richard Johnson, Siva P.V. Nadimpalli

Mechanical and Industrial Engr

Research output: Contribution to journal › Article › peer-review

18 Scopus citations

Abstract

Double cantilever beam (DCB) specimens consisting of Sn96.5Ag3.0Cu0.5 (SAC305) solder sandwiched between two copper bars were fabricated under standard surface mount processing conditions. Mode-I fracture tests were performed on the DCB specimens under various temperatures. The load–displacement behavior and critical loads corresponding to crack initiation were recorded and used in a finite element model of the DCB to evaluate critical energy release rates. Fracture surfaces were analyzed to understand the effect of temperature on crack path and fracture mechanism. The critical energy release rate decreased from 603 at −50 °C to 93 J/m² at 100 °C and the crack path shifted from solder/intermetallic compound interface to bulk solder.

Original language	English (US)
Pages (from-to)	730-738
Number of pages	9
Journal	Engineering Fracture Mechanics
Volume	199
DOIs	https://doi.org/10.1016/j.engfracmech.2018.07.004
State	Published - Aug 2018

All Science Journal Classification (ASJC) codes

General Materials Science
Mechanics of Materials
Mechanical Engineering

Keywords

Interface fracture
Intermetallics
J-integral
Lead-free solder
SAC305 fracture
Temperature effect

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10.1016/j.engfracmech.2018.07.004

Cite this

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title = "Effect of temperature on the fracture behavior of Cu/SAC305/Cu solder joints",

abstract = "Double cantilever beam (DCB) specimens consisting of Sn96.5Ag3.0Cu0.5 (SAC305) solder sandwiched between two copper bars were fabricated under standard surface mount processing conditions. Mode-I fracture tests were performed on the DCB specimens under various temperatures. The load–displacement behavior and critical loads corresponding to crack initiation were recorded and used in a finite element model of the DCB to evaluate critical energy release rates. Fracture surfaces were analyzed to understand the effect of temperature on crack path and fracture mechanism. The critical energy release rate decreased from 603 at −50 °C to 93 J/m2 at 100 °C and the crack path shifted from solder/intermetallic compound interface to bulk solder.",

keywords = "Interface fracture, Intermetallics, J-integral, Lead-free solder, SAC305 fracture, Temperature effect",

author = "Thompson, {Patrick B.} and Richard Johnson and Nadimpalli, {Siva P.V.}",

note = "Publisher Copyright: {\textcopyright} 2018",

year = "2018",

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doi = "10.1016/j.engfracmech.2018.07.004",

language = "English (US)",

volume = "199",

pages = "730--738",

journal = "Engineering Fracture Mechanics",

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T1 - Effect of temperature on the fracture behavior of Cu/SAC305/Cu solder joints

AU - Thompson, Patrick B.

AU - Johnson, Richard

AU - Nadimpalli, Siva P.V.

PY - 2018/8

Y1 - 2018/8

N2 - Double cantilever beam (DCB) specimens consisting of Sn96.5Ag3.0Cu0.5 (SAC305) solder sandwiched between two copper bars were fabricated under standard surface mount processing conditions. Mode-I fracture tests were performed on the DCB specimens under various temperatures. The load–displacement behavior and critical loads corresponding to crack initiation were recorded and used in a finite element model of the DCB to evaluate critical energy release rates. Fracture surfaces were analyzed to understand the effect of temperature on crack path and fracture mechanism. The critical energy release rate decreased from 603 at −50 °C to 93 J/m2 at 100 °C and the crack path shifted from solder/intermetallic compound interface to bulk solder.

AB - Double cantilever beam (DCB) specimens consisting of Sn96.5Ag3.0Cu0.5 (SAC305) solder sandwiched between two copper bars were fabricated under standard surface mount processing conditions. Mode-I fracture tests were performed on the DCB specimens under various temperatures. The load–displacement behavior and critical loads corresponding to crack initiation were recorded and used in a finite element model of the DCB to evaluate critical energy release rates. Fracture surfaces were analyzed to understand the effect of temperature on crack path and fracture mechanism. The critical energy release rate decreased from 603 at −50 °C to 93 J/m2 at 100 °C and the crack path shifted from solder/intermetallic compound interface to bulk solder.

KW - Interface fracture

KW - Intermetallics

KW - J-integral

KW - Lead-free solder

KW - SAC305 fracture

KW - Temperature effect

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JO - Engineering Fracture Mechanics

JF - Engineering Fracture Mechanics

ER -

Effect of temperature on the fracture behavior of Cu/SAC305/Cu solder joints

Abstract

All Science Journal Classification (ASJC) codes

Keywords

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