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Evaluation of encapsulation and passivation of InGaAs/InP DHBT devices for long-term reliability

  • R. F. Kopf
  • , R. A. Hamm
  • , R. W. Ryan
  • , J. Burm
  • , A. Tate
  • , Y. K. Chen
  • , G. Georgiou
  • , D. V. Lang
  • , F. Ren

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