Abstract
Ordered Si crystals with nanometer sizes are prepared in a Si/SiO2 superlattice structure using rf sputtering and plasma oxidation. Decreasing the a-Si layer thickness to 1.9 nm increases the inhomogeneous strain by one order of magnitude. An exponential increase of the crystallization temperature with decreasing thickness is found. A new model using the melting temperature and the interior amorphous crystallization temperature is reported. The extension of the model to Ge/SiO2 and Si/SiOx superlattices is demonstrated.
Original language | English (US) |
---|---|
Pages (from-to) | 640-644 |
Number of pages | 5 |
Journal | Journal of Non-Crystalline Solids |
Volume | 266-269 A |
DOIs | |
State | Published - May 1 2000 |
Externally published | Yes |
Event | 18th International Conference on Amorphous and Microcrystalline Semiconductors - Sicence and Technology (ICAMS 18) - Snowbird, UT, United States Duration: Aug 23 1999 → Aug 27 1999 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Ceramics and Composites
- Condensed Matter Physics
- Materials Chemistry