Formation of TiSi2/n + /p‐Silicon Junctions by Implantation through Metal Technique

N. M. Ravindra, Ying Wu, B. Shah, W. Savin, T. Fink, R. T. Lareau, R. L. Pfeffer

Research output: Contribution to journalArticlepeer-review

Fingerprint

Dive into the research topics of 'Formation of TiSi2/n + /p‐Silicon Junctions by Implantation through Metal Technique'. Together they form a unique fingerprint.

Engineering

Material Science

Keyphrases