Fracture load prediction of lead-free solder joints

Siva P.V. Nadimpalli, Jan K. Spelt

Research output: Contribution to journalArticlepeer-review

20 Scopus citations

Abstract

Continuous and discrete SAC305 solder joints of different lengths were made between copper bars under standard surface mount (SMT) processing conditions, and then fractured under mode-I loading. The load-displacement behavior corresponding to crack initiation and the subsequent toughening before ultimate failure were recorded and used to calculate the critical strain energy release rates. The fracture of the discrete solder joints was then simulated using finite elements with two different failure criteria: one in terms of the critical strain energy release rate at initiation, Gci, and another based on a cohesive zone model at the crack tip (CZM). Both criteria predicted the fracture loads reasonably well. In addition, the CZM was able to predict accurately the overall load-displacement behavior of the discrete joint specimen. It could also predict the load sharing that occurred between neighboring solder joints as a function of joint pitch and adherend stiffness. This has application in the modeling of the strength of solder joint arrays such as those found in ball grid array packages.

Original languageEnglish (US)
Pages (from-to)3446-3461
Number of pages16
JournalEngineering Fracture Mechanics
Volume77
Issue number17
DOIs
StatePublished - Nov 2010
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Keywords

  • Cohesive zone model
  • Critical energy release rate
  • Finite element analysis
  • Lead-free solder
  • Strength prediction

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