High aspect ratio Bosch etching of sub- 0.25 μm trenches for hyperintegration applications

Engineering & Materials Science

• Etching 100%
• Aspect ratio 85%
• Silicon 48%
• Inductively coupled plasma 46%
• Fabrication 45%
• Dry etching 45%
• Reactive ion etching 41%
• Passivation 37%
• MEMS 28%
• Integrated circuits 28%
• Plasmas 28%
• Ions 28%
• Substrates 21%

Physics & Astronomy

• high aspect ratio 99%
• etching 70%
• scalloping 53%
• fabrication 37%
• silicon 33%
• microelectromechanical systems 29%
• integrated circuits 29%
• ions 28%
• passivity 28%
• emerging 27%
• cycles 20%
• optimization 20%