High aspect ratio Bosch etching of sub- 0.25 μm trenches for hyperintegration applications

Keyphrases

• High Aspect Ratio 100%
• Bosch Etching 100%
• Micro-electro-mechanical Systems 33%
• Integrated Circuits 33%
• Deep Reactive Ion Etching 33%
• Silicon Substrate 33%
• Plasma Etching 33%
• Process Conditions 33%
• Time-multiplexing 33%
• Reactive Ion Etching 33%
• Submicron 33%
• Passivation 33%
• Inductively Coupled Plasma 33%
• Etching Process 33%
• High Aspect Ratio Trenches 33%
• Bosch Process 33%
• Array Pattern 33%
• Predict-then-optimize 33%
• Plasma Etcher 33%
• Silicon Etching 33%

Engineering

• High Aspect Ratio 100%
• Microelectromechanical System 25%
• Integrated Circuit 25%
• Silicon Substrate 25%
• Process Parameter 25%
• Passivation 25%
• Process Condition 25%
• Inductively Coupled Plasma 25%
• Dry Etching 25%
• Reactive Ion Etch 25%

Material Science

• Silicon 100%
• Electronic Circuit 50%
• Reactive Ion Etching 50%
• Microelectromechanical System 50%
• Dry Etching 50%