High fidelity and compact modeling for bone conduction communication systems

Andrzej Przekwas; Xianlian Zhou; X. G. Tan; Z. J. Chen; Debbie Reeves; Patrick Wilkerson; H. Q. Yang; Vincent Harrand; Valeta Carol Chancey

doi:10.1115/IMECE2009-12954

High fidelity and compact modeling for bone conduction communication systems

Andrzej Przekwas, Xianlian Zhou, X. G. Tan, Z. J. Chen, Debbie Reeves, Patrick Wilkerson, H. Q. Yang, Vincent Harrand, Valeta Carol Chancey

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English (US)
Title of host publication	Proceedings of the ASME International Mechanical Engineering Congress and Exposition 2009, IMECE 2009
Publisher	American Society of Mechanical Engineers (ASME)
Pages	485-486
Number of pages	2
ISBN (Print)	9780791843758
DOIs	https://doi.org/10.1115/IMECE2009-12954
State	Published - 2010
Externally published	Yes
Event	2009 ASME International Mechanical Engineering Congress and Exposition, IMECE2009 - Lake Buena Vista, FL, United States Duration: Nov 13 2009 → Nov 19 2009

Publication series

Name	ASME International Mechanical Engineering Congress and Exposition, Proceedings
Volume	2

Conference

Conference	2009 ASME International Mechanical Engineering Congress and Exposition, IMECE2009
Country/Territory	United States
City	Lake Buena Vista, FL
Period	11/13/09 → 11/19/09

All Science Journal Classification (ASJC) codes

Mechanical Engineering

Access to Document

10.1115/IMECE2009-12954

Cite this

Przekwas, A., Zhou, X., Tan, X. G., Chen, Z. J., Reeves, D., Wilkerson, P., Yang, H. Q., Harrand, V., & Chancey, V. C. (2010). High fidelity and compact modeling for bone conduction communication systems. In Proceedings of the ASME International Mechanical Engineering Congress and Exposition 2009, IMECE 2009 (pp. 485-486). (ASME International Mechanical Engineering Congress and Exposition, Proceedings; Vol. 2). American Society of Mechanical Engineers (ASME). https://doi.org/10.1115/IMECE2009-12954

Przekwas, Andrzej ; Zhou, Xianlian ; Tan, X. G. et al. / High fidelity and compact modeling for bone conduction communication systems. Proceedings of the ASME International Mechanical Engineering Congress and Exposition 2009, IMECE 2009. American Society of Mechanical Engineers (ASME), 2010. pp. 485-486 (ASME International Mechanical Engineering Congress and Exposition, Proceedings).

@inproceedings{368449d705574a41aa5e4bd1c7fa5b29,

title = "High fidelity and compact modeling for bone conduction communication systems",

author = "Andrzej Przekwas and Xianlian Zhou and Tan, {X. G.} and Chen, {Z. J.} and Debbie Reeves and Patrick Wilkerson and Yang, {H. Q.} and Vincent Harrand and Chancey, {Valeta Carol}",

year = "2010",

doi = "10.1115/IMECE2009-12954",

language = "English (US)",

isbn = "9780791843758",

series = "ASME International Mechanical Engineering Congress and Exposition, Proceedings",

publisher = "American Society of Mechanical Engineers (ASME)",

pages = "485--486",

booktitle = "Proceedings of the ASME International Mechanical Engineering Congress and Exposition 2009, IMECE 2009",

note = "2009 ASME International Mechanical Engineering Congress and Exposition, IMECE2009 ; Conference date: 13-11-2009 Through 19-11-2009",

}

Przekwas, A, Zhou, X, Tan, XG, Chen, ZJ, Reeves, D, Wilkerson, P, Yang, HQ, Harrand, V & Chancey, VC 2010, High fidelity and compact modeling for bone conduction communication systems. in Proceedings of the ASME International Mechanical Engineering Congress and Exposition 2009, IMECE 2009. ASME International Mechanical Engineering Congress and Exposition, Proceedings, vol. 2, American Society of Mechanical Engineers (ASME), pp. 485-486, 2009 ASME International Mechanical Engineering Congress and Exposition, IMECE2009, Lake Buena Vista, FL, United States, 11/13/09. https://doi.org/10.1115/IMECE2009-12954

High fidelity and compact modeling for bone conduction communication systems. / Przekwas, Andrzej; Zhou, Xianlian; Tan, X. G. et al.
Proceedings of the ASME International Mechanical Engineering Congress and Exposition 2009, IMECE 2009. American Society of Mechanical Engineers (ASME), 2010. p. 485-486 (ASME International Mechanical Engineering Congress and Exposition, Proceedings; Vol. 2).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - High fidelity and compact modeling for bone conduction communication systems

AU - Przekwas, Andrzej

AU - Zhou, Xianlian

AU - Tan, X. G.

AU - Chen, Z. J.

AU - Reeves, Debbie

AU - Wilkerson, Patrick

AU - Yang, H. Q.

AU - Harrand, Vincent

AU - Chancey, Valeta Carol

PY - 2010

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U2 - 10.1115/IMECE2009-12954

DO - 10.1115/IMECE2009-12954

M3 - Conference contribution

AN - SCOPUS:77954255998

SN - 9780791843758

T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings

SP - 485

EP - 486

BT - Proceedings of the ASME International Mechanical Engineering Congress and Exposition 2009, IMECE 2009

PB - American Society of Mechanical Engineers (ASME)

T2 - 2009 ASME International Mechanical Engineering Congress and Exposition, IMECE2009

Y2 - 13 November 2009 through 19 November 2009

ER -

Przekwas A, Zhou X, Tan XG, Chen ZJ, Reeves D, Wilkerson P et al. High fidelity and compact modeling for bone conduction communication systems. In Proceedings of the ASME International Mechanical Engineering Congress and Exposition 2009, IMECE 2009. American Society of Mechanical Engineers (ASME). 2010. p. 485-486. (ASME International Mechanical Engineering Congress and Exposition, Proceedings). doi: 10.1115/IMECE2009-12954

High fidelity and compact modeling for bone conduction communication systems

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All Science Journal Classification (ASJC) codes

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