How to start-up dual-arm cluster tools involving a wafer revisiting process

Chunrong Pan, Mengchu Zhou, Yan Qiao

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

For some wafer fabrication processes, e.g., atomic layer deposition, wafers need to visit some process modules for a number of times instead of once, which leads to a revisiting process. It is complicated to schedule cluster tools with wafer revisiting in semiconductor fabrication. Most studies on cluster tool scheduling aim to find the optimal steady state schedule. However, the recent trend to run small batches of different wafers has raised more needs for efficient start-up and close-down processes of cluster tools with wafer revisiting. This paper introduces two scheduling strategies to schedule the start-up transient process. After the tool finishes it from the idle state, it reaches a required steady state from which an optimal one-wafer cyclic schedule can be put into use. An industrial case is given to show the applications of the obtained results.

Original languageEnglish (US)
Title of host publication2015 IEEE Conference on Automation Science and Engineering
Subtitle of host publicationAutomation for a Sustainable Future, CASE 2015
PublisherIEEE Computer Society
Pages1194-1199
Number of pages6
Volume2015-October
ISBN (Electronic)9781467381833
DOIs
StatePublished - Oct 7 2015
Event11th IEEE International Conference on Automation Science and Engineering, CASE 2015 - Gothenburg, Sweden
Duration: Aug 24 2015Aug 28 2015

Other

Other11th IEEE International Conference on Automation Science and Engineering, CASE 2015
CountrySweden
CityGothenburg
Period8/24/158/28/15

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'How to start-up dual-arm cluster tools involving a wafer revisiting process'. Together they form a unique fingerprint.

Cite this