Abstract
Plasma-charging damage is known to be high-field injection phenomenon during plasma processing. The impact of this damage on low frequency MOSFET noise is investigated. The consensus is that plasma-charging damage increases the low frequency noise of the MOSFET. However, a strong dependence of the MOSFET low frequency noise is observed on the polarity of the plasma-charging damage. When the damage is of the gate-injection type, the MOSFET low frequency noise is insensitive to damage, whereas when the polarity is of substrate-injection type, the MOSFET low frequency noise is very sensitive to damage.
Original language | English (US) |
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Pages (from-to) | 437-440 |
Number of pages | 4 |
Journal | Technical Digest - International Electron Devices Meeting, IEDM |
State | Published - 1997 |
Externally published | Yes |
Event | 1997 International Electron Devices Meeting - Washington, DC, USA Duration: Dec 7 1997 → Dec 10 1997 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry