Large-strain thermo-mechanical behavior of cyclic olefin copolymers: Application to hot embossing and thermal bonding for the fabrication of microfluidic devices

  • R. K. Jena
  • , S. A. Chester
  • , V. Srivastava
  • , C. Y. Yue
  • , L. Anand
  • , Y. C. Lam

Research output: Contribution to journal › Article › peer-review

38 Scopus citations

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Engineering