Large-strain thermo-mechanical behavior of cyclic olefin copolymers: Application to hot embossing and thermal bonding for the fabrication of microfluidic devices
R. K. Jena, S. A. Chester, V. Srivastava, C. Y. Yue, L. Anand, Y. C. Lam
Research output: Contribution to journal › Article › peer-review
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