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Low thermal budget processing for sequential 3-D IC fabrication
Bipin Rajendran
, Rohit S. Shenoy
, Daniel J. Witte
, Nehal S. Chokshi
, Robert L. DeLeon
, Gary S. Tompa
, R. Fabian W. Pease
Research output
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Contribution to journal
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Article
›
peer-review
67
Scopus citations
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Keyphrases
Dopant
100%
3D IC
100%
IC Manufacturing
100%
Low Thermal Budget
100%
Laser Annealing
100%
Upper Level
66%
Electrical Activation
33%
Transistor
33%
Gate Oxide
33%
Circuit Structure
33%
Deposition Process
33%
CMOS Transistor
33%
Oxide Deposition
33%
Low-temperature Oxides
33%
Material Science
Doping (Additives)
100%
Oxide Compound
66%
Transistor
66%
Electronic Circuit
33%
Annealing
33%