Magnetic bubble dual-in-line package (DIP) functional and reliability testing

R. Kowalchuk, A. H. Bobeck, A. D. Butherus, F. J. Ciak, D. H. Smith

Research output: Contribution to journalArticlepeer-review

6 Scopus citations

Abstract

Computer tested magnetic bubble chips have been assembled into dual-in-line packages (DIPs). In order to insure that stringent telephone station apparatus specifications are met, many packages have been subjected to extensive functional and environmental tests. From the functional tests average values and standard deviations of operating parameters at minimum rotating field over the temperature range of −25°C to +50°C have been determined. Environmental tests included temperature cycling (−40° C to +65°C), thermal shock, high temperature at high humidity (85% humidity/85°C), and mechanical shock and vibration. Of the 74 packages subjected to all environmental tests, 48 (or 64.9%) passed. Data indicate the package design to be good in terms of meeting operational, shock and vibration requirements; however, improvements in bond reliability are indicated.

Original languageEnglish (US)
Pages (from-to)691-693
Number of pages3
JournalIEEE Transactions on Magnetics
Volume12
Issue number6
DOIs
StatePublished - Nov 1976
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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