TY - GEN
T1 - Magnetic In/Near-Sensor Architectures
T2 - 35th Edition of the Great Lakes Symposium on VLSI 2025, GLSVLSI 2025
AU - Tabrizchi, Sepehr
AU - Shafiee Sarvestani, Ali
AU - Amin, Md Hasibul
AU - Najafi, Deniz
AU - Angizi, Shaahin
AU - Zand, Ramtin
AU - Roohi, Arman
N1 - Publisher Copyright:
© 2025 Copyright held by the owner/author(s). Publication rights licensed to ACM.
PY - 2025/6/29
Y1 - 2025/6/29
N2 - Recent advances in spintronic devices and non-Von Neumann architectures present promising pathways to address the power and efficiency bottlenecks of conventional computing. Spintronic technologies - such as Magneto-Electric FETs and Spin-Orbit Torque MRAM - offer non-volatility, low-power operation, and high-speed performance, ideal for data- and compute-intensive workloads. Meanwhile, in-sensor processing enables energy-efficient, low-latency computing by tightly integrating sensing and computation, minimizing data movement. This survey reviews state-of-the-art magnetic-based integrated sensing and processing paradigms, outlining key capabilities, challenges in device integration, and emerging applications. We conclude with future research directions, underscoring the need for cross-disciplinary collaboration spanning device engineering, circuit design, and system architecture.
AB - Recent advances in spintronic devices and non-Von Neumann architectures present promising pathways to address the power and efficiency bottlenecks of conventional computing. Spintronic technologies - such as Magneto-Electric FETs and Spin-Orbit Torque MRAM - offer non-volatility, low-power operation, and high-speed performance, ideal for data- and compute-intensive workloads. Meanwhile, in-sensor processing enables energy-efficient, low-latency computing by tightly integrating sensing and computation, minimizing data movement. This survey reviews state-of-the-art magnetic-based integrated sensing and processing paradigms, outlining key capabilities, challenges in device integration, and emerging applications. We conclude with future research directions, underscoring the need for cross-disciplinary collaboration spanning device engineering, circuit design, and system architecture.
UR - https://www.scopus.com/pages/publications/105017588685
UR - https://www.scopus.com/pages/publications/105017588685#tab=citedBy
U2 - 10.1145/3716368.3735267
DO - 10.1145/3716368.3735267
M3 - Conference contribution
AN - SCOPUS:105017588685
T3 - Proceedings of the ACM Great Lakes Symposium on VLSI, GLSVLSI
SP - 593
EP - 599
BT - GLSVLSI 2025 - Proceedings of the Great Lakes Symposium on VLSI 2025
PB - Association for Computing Machinery
Y2 - 30 June 2025 through 2 July 2025
ER -