Measurement of stress in a synthetic diamond substrate using the photoelastic method

Hancheng Liang, Andrei Vescan, Erhard Kohn, Ken K. Chin

Research output: Contribution to journalArticlepeer-review

2 Scopus citations


The residual stress in a synthetic diamond substrate was analyzed using an automatic data acquisition and analysis system based on photoelastic principles. Digital image processing techniques were applied to improve the quality of the sensed images, to reduce noise and to determine the boundary of the measured samples. Methods were also introduced to calculate the birefringence phase difference and principal stress directions. The shearing stress difference method was applied to calculate the two-dimensional stress distribution.

Original languageEnglish (US)
Pages (from-to)664-668
Number of pages5
JournalDiamond and Related Materials
Issue number6-8
StatePublished - May 1996

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • General Chemistry
  • Mechanical Engineering
  • Materials Chemistry
  • Electrical and Electronic Engineering


  • Diamond
  • Measurement
  • Photoelasticity
  • Stress


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