Mechanical characterization of multilayer thin film stacks containing porous silica using nanoindentation and the finite element method

Engineering & Materials Science

• Multilayer films 100%
• Nanoindentation 79%
• Silica 67%
• Permittivity 66%
• Thin films 62%
• Homogenization method 46%
• Delay circuits 45%
• Mechanical properties 42%
• Metals 42%
• Micromechanics 40%
• Finite element method 40%
• Integrated circuits 30%
• Semiconductor materials 29%
• Porosity 28%
• Capacitance 28%
• Copper 26%
• Substrates 23%
• Composite materials 19%
• Industry 14%

Physics & Astronomy

• nanoindentation 66%
• delay circuits 56%
• finite element method 54%
• silicon dioxide 50%
• permittivity 45%
• mechanical properties 44%
• micromechanics 41%
• characterization 36%
• homogenizing 34%
• thin films 33%
• metals 33%
• integrated circuits 31%
• industries 27%
• capacitance 26%
• porosity 23%
• copper 23%
• composite materials 20%
• simulation 12%

Chemical Compounds

• Dielectric Constant 60%
• Multilayer 58%
• Dielectric Material 58%
• Multilayer Film 38%
• Porosity 38%
• Homogenization 37%
• Metal 29%
• Semiconductor 25%
• Dimension 24%
• Industry 24%
• Simulation 20%
• Composite Material 16%