Modeling and analysis of dual-arm cluster tools for wafer fabrication with revisiting

Yan Qiao, Nai Qi Wu, Mengchu Zhou

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Scopus citations

Abstract

Some wafer fabrication processes are repeated processes, e.g. atomic layer deposition (ALD) process. For such processes, the wafers need to visit some processing modules for a number of times, which complicates the cycle time analysis. This paper studies the cycle time analysis problem for such processes. With a Petri net model, it is found that such processes contain local cycles involving only the revisiting PMs and global cycles involving both revisiting and non-revisiting PMs. The process switches between these two types of cycles such that the process never reaches a steady state. Based on this finding, the mechanism underlying such processes is revealed and analytical expressions are given for the calculation of their cycle time. Illustrative examples are presented to show the application of the proposed approach.

Original languageEnglish (US)
Title of host publication2011 IEEE International Conference on Automation Science and Engineering, CASE 2011
Pages90-95
Number of pages6
DOIs
StatePublished - Dec 5 2011
Event2011 7th IEEE International Conference on Automation Science and Engineering, CASE 2011 - Trieste, Italy
Duration: Aug 24 2011Aug 27 2011

Publication series

NameIEEE International Conference on Automation Science and Engineering
ISSN (Print)2161-8070
ISSN (Electronic)2161-8089

Other

Other2011 7th IEEE International Conference on Automation Science and Engineering, CASE 2011
Country/TerritoryItaly
CityTrieste
Period8/24/118/27/11

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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