Modeling and scheduling of cluster tools dealing with wafer revisiting: A brief review

Chunrong Pan, Mengchu Zhou, Yan Qiao, Naiqi Wu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

Abstract

For some fabrication processes, such as atomic layer deposition, wafers need to visit some process modules for a number of times, instead of once, thus leading to a revisiting process. It is complicated to schedule cluster tools with wafer revisit in semiconductor fabrication. This paper briefly discusses the modeling and scheduling issues for cluster tools dealing with a revisiting process. Then, we review and compare the methods for their modeling and scheduling. Finally, future research directions and conclusions with a revisiting process are finally given.

Original languageEnglish (US)
Title of host publicationICNSC 2015 - 2015 IEEE 12th International Conference on Networking, Sensing and Control
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages271-276
Number of pages6
ISBN (Electronic)9781479980697
DOIs
StatePublished - Jun 1 2015
Externally publishedYes
Event2015 12th IEEE International Conference on Networking, Sensing and Control, ICNSC 2015 - Taipei, Taiwan, Province of China
Duration: Apr 9 2015Apr 11 2015

Publication series

NameICNSC 2015 - 2015 IEEE 12th International Conference on Networking, Sensing and Control

Other

Other2015 12th IEEE International Conference on Networking, Sensing and Control, ICNSC 2015
CountryTaiwan, Province of China
CityTaipei
Period4/9/154/11/15

All Science Journal Classification (ASJC) codes

  • Instrumentation
  • Control and Systems Engineering
  • Computer Networks and Communications

Keywords

  • Cluster tools
  • Revisiting processes
  • Semiconductor manufacturing
  • scheduling

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