Modeling and scheduling of cluster tools dealing with wafer revisiting: A brief review

Chunrong Pan; Mengchu Zhou; Yan Qiao; Naiqi Wu

doi:10.1109/ICNSC.2015.7116047

Modeling and scheduling of cluster tools dealing with wafer revisiting: A brief review

Chunrong Pan, Mengchu Zhou, Yan Qiao, Naiqi Wu

Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

6 Scopus citations

Abstract

For some fabrication processes, such as atomic layer deposition, wafers need to visit some process modules for a number of times, instead of once, thus leading to a revisiting process. It is complicated to schedule cluster tools with wafer revisit in semiconductor fabrication. This paper briefly discusses the modeling and scheduling issues for cluster tools dealing with a revisiting process. Then, we review and compare the methods for their modeling and scheduling. Finally, future research directions and conclusions with a revisiting process are finally given.

Original language	English (US)
Title of host publication	ICNSC 2015 - 2015 IEEE 12th International Conference on Networking, Sensing and Control
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	271-276
Number of pages	6
ISBN (Electronic)	9781479980697
DOIs	https://doi.org/10.1109/ICNSC.2015.7116047
State	Published - Jun 1 2015
Event	2015 12th IEEE International Conference on Networking, Sensing and Control, ICNSC 2015 - Taipei, Taiwan, Province of China Duration: Apr 9 2015 → Apr 11 2015

Publication series

Name	ICNSC 2015 - 2015 IEEE 12th International Conference on Networking, Sensing and Control

Other

Other	2015 12th IEEE International Conference on Networking, Sensing and Control, ICNSC 2015
Country/Territory	Taiwan, Province of China
City	Taipei
Period	4/9/15 → 4/11/15

All Science Journal Classification (ASJC) codes

Instrumentation
Control and Systems Engineering
Computer Networks and Communications

Keywords

Cluster tools
Revisiting processes
Semiconductor manufacturing
scheduling

Access to Document

10.1109/ICNSC.2015.7116047

Cite this

Pan, C., Zhou, M., Qiao, Y., & Wu, N. (2015). Modeling and scheduling of cluster tools dealing with wafer revisiting: A brief review. In ICNSC 2015 - 2015 IEEE 12th International Conference on Networking, Sensing and Control (pp. 271-276). Article 7116047 (ICNSC 2015 - 2015 IEEE 12th International Conference on Networking, Sensing and Control). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICNSC.2015.7116047

Pan, Chunrong ; Zhou, Mengchu ; Qiao, Yan et al. / Modeling and scheduling of cluster tools dealing with wafer revisiting : A brief review. ICNSC 2015 - 2015 IEEE 12th International Conference on Networking, Sensing and Control. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 271-276 (ICNSC 2015 - 2015 IEEE 12th International Conference on Networking, Sensing and Control).

@inproceedings{e9fc02bea4b041c193778d50fa81710e,

title = "Modeling and scheduling of cluster tools dealing with wafer revisiting: A brief review",

abstract = "For some fabrication processes, such as atomic layer deposition, wafers need to visit some process modules for a number of times, instead of once, thus leading to a revisiting process. It is complicated to schedule cluster tools with wafer revisit in semiconductor fabrication. This paper briefly discusses the modeling and scheduling issues for cluster tools dealing with a revisiting process. Then, we review and compare the methods for their modeling and scheduling. Finally, future research directions and conclusions with a revisiting process are finally given.",

keywords = "Cluster tools, Revisiting processes, Semiconductor manufacturing, scheduling",

author = "Chunrong Pan and Mengchu Zhou and Yan Qiao and Naiqi Wu",

note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; 2015 12th IEEE International Conference on Networking, Sensing and Control, ICNSC 2015 ; Conference date: 09-04-2015 Through 11-04-2015",

year = "2015",

month = jun,

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doi = "10.1109/ICNSC.2015.7116047",

language = "English (US)",

series = "ICNSC 2015 - 2015 IEEE 12th International Conference on Networking, Sensing and Control",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

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booktitle = "ICNSC 2015 - 2015 IEEE 12th International Conference on Networking, Sensing and Control",

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Pan, C, Zhou, M, Qiao, Y & Wu, N 2015, Modeling and scheduling of cluster tools dealing with wafer revisiting: A brief review. in ICNSC 2015 - 2015 IEEE 12th International Conference on Networking, Sensing and Control., 7116047, ICNSC 2015 - 2015 IEEE 12th International Conference on Networking, Sensing and Control, Institute of Electrical and Electronics Engineers Inc., pp. 271-276, 2015 12th IEEE International Conference on Networking, Sensing and Control, ICNSC 2015, Taipei, Taiwan, Province of China, 4/9/15. https://doi.org/10.1109/ICNSC.2015.7116047

Modeling and scheduling of cluster tools dealing with wafer revisiting: A brief review. / Pan, Chunrong; Zhou, Mengchu; Qiao, Yan et al.
ICNSC 2015 - 2015 IEEE 12th International Conference on Networking, Sensing and Control. Institute of Electrical and Electronics Engineers Inc., 2015. p. 271-276 7116047 (ICNSC 2015 - 2015 IEEE 12th International Conference on Networking, Sensing and Control).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

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AU - Pan, Chunrong

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PY - 2015/6/1

Y1 - 2015/6/1

N2 - For some fabrication processes, such as atomic layer deposition, wafers need to visit some process modules for a number of times, instead of once, thus leading to a revisiting process. It is complicated to schedule cluster tools with wafer revisit in semiconductor fabrication. This paper briefly discusses the modeling and scheduling issues for cluster tools dealing with a revisiting process. Then, we review and compare the methods for their modeling and scheduling. Finally, future research directions and conclusions with a revisiting process are finally given.

AB - For some fabrication processes, such as atomic layer deposition, wafers need to visit some process modules for a number of times, instead of once, thus leading to a revisiting process. It is complicated to schedule cluster tools with wafer revisit in semiconductor fabrication. This paper briefly discusses the modeling and scheduling issues for cluster tools dealing with a revisiting process. Then, we review and compare the methods for their modeling and scheduling. Finally, future research directions and conclusions with a revisiting process are finally given.

KW - Cluster tools

KW - Revisiting processes

KW - Semiconductor manufacturing

KW - scheduling

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Pan C, Zhou M, Qiao Y, Wu N. Modeling and scheduling of cluster tools dealing with wafer revisiting: A brief review. In ICNSC 2015 - 2015 IEEE 12th International Conference on Networking, Sensing and Control. Institute of Electrical and Electronics Engineers Inc. 2015. p. 271-276. 7116047. (ICNSC 2015 - 2015 IEEE 12th International Conference on Networking, Sensing and Control). doi: 10.1109/ICNSC.2015.7116047

Modeling and scheduling of cluster tools dealing with wafer revisiting: A brief review

Abstract

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All Science Journal Classification (ASJC) codes

Keywords

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