@inproceedings{e9fc02bea4b041c193778d50fa81710e,
title = "Modeling and scheduling of cluster tools dealing with wafer revisiting: A brief review",
abstract = "For some fabrication processes, such as atomic layer deposition, wafers need to visit some process modules for a number of times, instead of once, thus leading to a revisiting process. It is complicated to schedule cluster tools with wafer revisit in semiconductor fabrication. This paper briefly discusses the modeling and scheduling issues for cluster tools dealing with a revisiting process. Then, we review and compare the methods for their modeling and scheduling. Finally, future research directions and conclusions with a revisiting process are finally given.",
keywords = "Cluster tools, Revisiting processes, Semiconductor manufacturing, scheduling",
author = "Chunrong Pan and Mengchu Zhou and Yan Qiao and Naiqi Wu",
year = "2015",
month = jun,
day = "1",
doi = "10.1109/ICNSC.2015.7116047",
language = "English (US)",
series = "ICNSC 2015 - 2015 IEEE 12th International Conference on Networking, Sensing and Control",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "271--276",
booktitle = "ICNSC 2015 - 2015 IEEE 12th International Conference on Networking, Sensing and Control",
address = "United States",
note = "2015 12th IEEE International Conference on Networking, Sensing and Control, ICNSC 2015 ; Conference date: 09-04-2015 Through 11-04-2015",
}