Modeling of magnetic-field-assisted assembly of semiconductor devices

Rene D. Rivero; Sudhakar Shet; Michael R. Booty; Anthony T. Fiory; Nuggehalli M. Ravindra

doi:10.1007/s11664-007-0351-x

Modeling of magnetic-field-assisted assembly of semiconductor devices

Rene D. Rivero, Sudhakar Shet, Michael R. Booty, Anthony T. Fiory, Nuggehalli M. Ravindra

Research output: Contribution to journal › Article › peer-review

10 Scopus citations

Abstract

The process of magnetic-field-assisted assembly for the integration of semiconductor devices is described. A simplified model that is relevant to both magnetically assisted statistical assembly and magnetic-field-assisted assembly is presented. This two-dimensional, periodic model, which is a development of earlier work by Fonstad and coworkers, is solved using Fourier series, and an expression is found for the magnetic force of attraction between a soft magnetic layer and an array of permanently magnetized strips. The results show an exponential decrease of force with distance and the dependence of the force on other parameters such as layer thickness and spacing.

Original language	English (US)
Pages (from-to)	374-378
Number of pages	5
Journal	Journal of Electronic Materials
Volume	37
Issue number	4
DOIs	https://doi.org/10.1007/s11664-007-0351-x
State	Published - Apr 2008

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

Keywords

Heterogeneous integration
MEMS
Magnetic field
Microassembly
Self-assembly

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10.1007/s11664-007-0351-x

Cite this

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title = "Modeling of magnetic-field-assisted assembly of semiconductor devices",

abstract = "The process of magnetic-field-assisted assembly for the integration of semiconductor devices is described. A simplified model that is relevant to both magnetically assisted statistical assembly and magnetic-field-assisted assembly is presented. This two-dimensional, periodic model, which is a development of earlier work by Fonstad and coworkers, is solved using Fourier series, and an expression is found for the magnetic force of attraction between a soft magnetic layer and an array of permanently magnetized strips. The results show an exponential decrease of force with distance and the dependence of the force on other parameters such as layer thickness and spacing.",

keywords = "Heterogeneous integration, MEMS, Magnetic field, Microassembly, Self-assembly",

author = "Rivero, {Rene D.} and Sudhakar Shet and Booty, {Michael R.} and Fiory, {Anthony T.} and Ravindra, {Nuggehalli M.}",

note = "Funding Information: The partial financial support of the New Jersey Commission on Science and Technology and the recognition and support of The Research and Development Council of New Jersey is acknowledged with thanks. The authors thank Kuan Xu for preparing Fig. 5.",

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doi = "10.1007/s11664-007-0351-x",

language = "English (US)",

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T1 - Modeling of magnetic-field-assisted assembly of semiconductor devices

AU - Rivero, Rene D.

AU - Shet, Sudhakar

AU - Booty, Michael R.

AU - Fiory, Anthony T.

AU - Ravindra, Nuggehalli M.

N1 - Funding Information: The partial financial support of the New Jersey Commission on Science and Technology and the recognition and support of The Research and Development Council of New Jersey is acknowledged with thanks. The authors thank Kuan Xu for preparing Fig. 5.

PY - 2008/4

Y1 - 2008/4

N2 - The process of magnetic-field-assisted assembly for the integration of semiconductor devices is described. A simplified model that is relevant to both magnetically assisted statistical assembly and magnetic-field-assisted assembly is presented. This two-dimensional, periodic model, which is a development of earlier work by Fonstad and coworkers, is solved using Fourier series, and an expression is found for the magnetic force of attraction between a soft magnetic layer and an array of permanently magnetized strips. The results show an exponential decrease of force with distance and the dependence of the force on other parameters such as layer thickness and spacing.

AB - The process of magnetic-field-assisted assembly for the integration of semiconductor devices is described. A simplified model that is relevant to both magnetically assisted statistical assembly and magnetic-field-assisted assembly is presented. This two-dimensional, periodic model, which is a development of earlier work by Fonstad and coworkers, is solved using Fourier series, and an expression is found for the magnetic force of attraction between a soft magnetic layer and an array of permanently magnetized strips. The results show an exponential decrease of force with distance and the dependence of the force on other parameters such as layer thickness and spacing.

KW - Heterogeneous integration

KW - MEMS

KW - Magnetic field

KW - Microassembly

KW - Self-assembly

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DO - 10.1007/s11664-007-0351-x

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SP - 374

EP - 378

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

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Modeling of magnetic-field-assisted assembly of semiconductor devices

Abstract

All Science Journal Classification (ASJC) codes

Keywords

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