Modeling of magnetic-field-assisted assembly of semiconductor devices

Rene D. Rivero, Sudhakar Shet, Michael R. Booty, Anthony T. Fiory, Nuggehalli M. Ravindra

Research output: Contribution to journalArticlepeer-review

10 Scopus citations


The process of magnetic-field-assisted assembly for the integration of semiconductor devices is described. A simplified model that is relevant to both magnetically assisted statistical assembly and magnetic-field-assisted assembly is presented. This two-dimensional, periodic model, which is a development of earlier work by Fonstad and coworkers, is solved using Fourier series, and an expression is found for the magnetic force of attraction between a soft magnetic layer and an array of permanently magnetized strips. The results show an exponential decrease of force with distance and the dependence of the force on other parameters such as layer thickness and spacing.

Original languageEnglish (US)
Pages (from-to)374-378
Number of pages5
JournalJournal of Electronic Materials
Issue number4
StatePublished - Apr 2008

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry


  • Heterogeneous integration
  • MEMS
  • Magnetic field
  • Microassembly
  • Self-assembly


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