Novel low cost launch for measuring via-to-cavity coupling

Fadi Deek, Melinda Piket-May, Eric Bogatin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In order to isolate the effect of coupling between a signal via and a PCB or package cavity a novel launch setup is described and analyzed. This low cost launch consists of using a 0.35$ USD SMA connectors soldered as surface mount to each side of a signal via. Use of hot glue melt provides mechanical stability and reduces impedance discontinuity. The proposed setup measures the true effect of how a via excites a cavity without perturbing the cavity.

Original languageEnglish (US)
Title of host publication2021 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781665466134
DOIs
StatePublished - 2021
Externally publishedYes
Event2021 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2021 - Urbana, United States
Duration: Dec 13 2021Dec 15 2021

Publication series

NameIEEE Electrical Design of Advanced Packaging and Systems Symposium
Volume2021-December
ISSN (Print)2151-1225
ISSN (Electronic)2151-1233

Conference

Conference2021 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2021
Country/TerritoryUnited States
CityUrbana
Period12/13/2112/15/21

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Electrical and Electronic Engineering
  • Automotive Engineering
  • Computer Science(all)

Keywords

  • PCB
  • cavity
  • coupling
  • launch
  • measurement
  • signal
  • simulation
  • via

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