@inproceedings{03f8bc4b411949948a10ba6b7cac95bb,
title = "Novel low cost launch for measuring via-to-cavity coupling",
abstract = "In order to isolate the effect of coupling between a signal via and a PCB or package cavity a novel launch setup is described and analyzed. This low cost launch consists of using a 0.35$ USD SMA connectors soldered as surface mount to each side of a signal via. Use of hot glue melt provides mechanical stability and reduces impedance discontinuity. The proposed setup measures the true effect of how a via excites a cavity without perturbing the cavity. ",
keywords = "PCB, cavity, coupling, launch, measurement, signal, simulation, via",
author = "Fadi Deek and Melinda Piket-May and Eric Bogatin",
note = "Funding Information: This work was partially funded by Siemens EDA Publisher Copyright: {\textcopyright} 2021 IEEE.; 2021 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2021 ; Conference date: 13-12-2021 Through 15-12-2021",
year = "2021",
doi = "10.1109/EDAPS53774.2021.9657023",
language = "English (US)",
series = "IEEE Electrical Design of Advanced Packaging and Systems Symposium",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2021 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2021",
address = "United States",
}