Numerical Modeling of Fiber Push-Out Test in Metallic and Intermetallic Matrix Composites-Mechanics of the Failure Process

C. R. Ananth, N. Chandra

Research output: Contribution to journalArticlepeer-review

46 Scopus citations


The application of push-out test to characterize the mechanical behavior of interfaces in Metallic and Intermetallic Matrix Composites (MMCs and IMCs) is studied using Finite Element Method. A stress based criterion for debonding, and frictional resistance based criterion for interfacial sliding are used in the proposed model to predict the interfacial behavior during the push-out test. The complexities involved in modeling the process, and interpretation of the experimental results in the case of MMCs and IMCs, as compared with Ceramic Matrix Composites (CMCs) are addressed. The mechanics of interface failure is analyzed and an attempt is made to capture the debonding sequence during a thin-slice push-out test. The effect of different material and testing variables on the experimental observations are studied. The influence of processing induced residual stresses on interface behavior during the push-out test is examined in detail, with the main focus on the role of residual shear stresses in a thin-slice push-out test. The elastic-plastic behavior of the matrix and the temperature dependency of the constitutive properties are included in the analysis. The push-out behavior at elevated temperatures is also studied. The effect of temperature on the peak load in push-out tests, predicted using the proposed model, qualitatively agrees with the experimental observations.

Original languageEnglish (US)
Pages (from-to)1488-1514
Number of pages27
JournalJournal of Composite Materials
Issue number11
StatePublished - Jul 1995
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Ceramics and Composites
  • Mechanics of Materials
  • Mechanical Engineering
  • Materials Chemistry


  • finite element analysis
  • interfacial shear strength
  • push-out test
  • residual stress


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