Parameter estimation for evaluating ability of a rapid thermal processing system to maintain uniform temperature

Sergey Belikov, Michael Kaplinsky, Bernard Friedland

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

An important issue in the design of a rapid thermal processing (RTP) system is the ability of the system to maintain a uniform temperature in a semiconductor wafer. This ability is a characteristics of the radiative heat transfer properties of the system which often cannot be predicted accurately without testing the system. This paper presents a method of experimentally determining if an RTP system can maintain a uniform temperature. The method, which uses a recently-developed method of parameter estimation, has been demonstrated experimentally with an RTP system under investigation at NJIT.

Original languageEnglish (US)
Title of host publicationIEEE Conference on Control Applications - Proceedings
PublisherIEEE
Pages643-648
Number of pages6
StatePublished - Dec 1 1995
EventProceedings of the 1995 IEEE Conference on Control Applications - Albany, NY, USA
Duration: Sep 28 1995Sep 29 1995

Other

OtherProceedings of the 1995 IEEE Conference on Control Applications
CityAlbany, NY, USA
Period9/28/959/29/95

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering

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