Parameter estimation for evaluating ability of a rapid thermal processing system to maintain uniform temperature

Sergey Belikov; Michael Kaplinsky; Bernard Friedland

Parameter estimation for evaluating ability of a rapid thermal processing system to maintain uniform temperature

Sergey Belikov, Michael Kaplinsky, Bernard Friedland

Electrical and Computer Engineering

Research output: Contribution to conference › Paper › peer-review

Abstract

An important issue in the design of a rapid thermal processing (RTP) system is the ability of the system to maintain a uniform temperature in a semiconductor wafer. This ability is a characteristics of the radiative heat transfer properties of the system which often cannot be predicted accurately without testing the system. This paper presents a method of experimentally determining if an RTP system can maintain a uniform temperature. The method, which uses a recently-developed method of parameter estimation, has been demonstrated experimentally with an RTP system under investigation at NJIT.

Original language	English (US)
Pages	643-648
Number of pages	6
State	Published - 1995
Event	Proceedings of the 1995 IEEE Conference on Control Applications - Albany, NY, USA Duration: Sep 28 1995 → Sep 29 1995

Other

Other	Proceedings of the 1995 IEEE Conference on Control Applications
City	Albany, NY, USA
Period	9/28/95 → 9/29/95

All Science Journal Classification (ASJC) codes

Control and Systems Engineering

Cite this

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title = "Parameter estimation for evaluating ability of a rapid thermal processing system to maintain uniform temperature",

abstract = "An important issue in the design of a rapid thermal processing (RTP) system is the ability of the system to maintain a uniform temperature in a semiconductor wafer. This ability is a characteristics of the radiative heat transfer properties of the system which often cannot be predicted accurately without testing the system. This paper presents a method of experimentally determining if an RTP system can maintain a uniform temperature. The method, which uses a recently-developed method of parameter estimation, has been demonstrated experimentally with an RTP system under investigation at NJIT.",

author = "Sergey Belikov and Michael Kaplinsky and Bernard Friedland",

year = "1995",

language = "English (US)",

pages = "643--648",

note = "Proceedings of the 1995 IEEE Conference on Control Applications ; Conference date: 28-09-1995 Through 29-09-1995",

}

TY - CONF

T1 - Parameter estimation for evaluating ability of a rapid thermal processing system to maintain uniform temperature

AU - Belikov, Sergey

AU - Kaplinsky, Michael

AU - Friedland, Bernard

PY - 1995

Y1 - 1995

N2 - An important issue in the design of a rapid thermal processing (RTP) system is the ability of the system to maintain a uniform temperature in a semiconductor wafer. This ability is a characteristics of the radiative heat transfer properties of the system which often cannot be predicted accurately without testing the system. This paper presents a method of experimentally determining if an RTP system can maintain a uniform temperature. The method, which uses a recently-developed method of parameter estimation, has been demonstrated experimentally with an RTP system under investigation at NJIT.

AB - An important issue in the design of a rapid thermal processing (RTP) system is the ability of the system to maintain a uniform temperature in a semiconductor wafer. This ability is a characteristics of the radiative heat transfer properties of the system which often cannot be predicted accurately without testing the system. This paper presents a method of experimentally determining if an RTP system can maintain a uniform temperature. The method, which uses a recently-developed method of parameter estimation, has been demonstrated experimentally with an RTP system under investigation at NJIT.

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UR - http://www.scopus.com/inward/citedby.url?scp=0029507263&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:0029507263

SP - 643

EP - 648

T2 - Proceedings of the 1995 IEEE Conference on Control Applications

Y2 - 28 September 1995 through 29 September 1995

ER -

Parameter estimation for evaluating ability of a rapid thermal processing system to maintain uniform temperature

Abstract

Other

All Science Journal Classification (ASJC) codes

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