Plasma-enhanced chemical vapor deposition of polyperinaphthalene thin films

Keyphrases

• Plasma-enhanced Chemical Vapor Deposition (PECVD) 100%
• 3,4,9,10-Perylenetetracarboxylic Dianhydride 100%
• Perylene 66%
• Fourier Transform Infrared Spectroscopy (FT-IR) 33%
• Plasma Deposition 33%
• Chemical Structure 33%
• Electrical Conductivity 33%
• Scanning Electron Microscopy 33%
• Morphological Structure 33%
• Morphological Characteristics 33%
• In(III) 33%
• Corrosion 33%
• Deposition Parameters 33%
• Steel Substrate 33%
• Coated Glass 33%
• Indium Tin Oxide 33%
• Semiconducting Films 33%
• Substrate Temperature 33%
• Cross-linked Polymer 33%
• Potentiodynamic Corrosion 33%
• Thin Film Growth 33%
• Plasma Condition 33%
• Molecular Characteristics 33%
• Non-catalytic 33%
• Plasma Enhanced 33%
• Anhydride Group 33%
• Nanoscale Morphology 33%
• Corrosion Measurement 33%
• Catalyst Substrate 33%
• Corrosion Protection 33%
• Protection Layer 33%
• Thermal Chemical Vapor Deposition 33%
• Metal Substrate 33%
• Graphite-like 33%

Material Science

• Film 100%
• Thin Films 100%
• Plasma-Enhanced Chemical Vapor Deposition 100%
• Corrosion 66%
• Silicon 33%
• Scanning Electron Microscopy 33%
• Aluminum 33%
• Structure (Composition) 33%
• Transition Metal 33%
• Electrical Conductivity 33%
• Polymerization 33%
• Fourier Transform Infrared Spectroscopy 33%
• Indium Tin Oxide 33%
• Plasma Deposition 33%
• Thin Film Growth 33%
• Thermal Chemical Vapor Deposition 33%
• Corrosion Protection 33%

Chemical Engineering

• Plasma Enhanced Chemical Vapor Deposition 100%
• Transition Metal 33%
• Polymerization 33%
• Chemical Vapor Deposition 33%
• Vapor Deposition 33%
• Indium 33%
• Tin Oxide 33%
• Plasma Deposition 33%