Preface

P. J. Timans, F. Roozeboom, K. Kakushima, E. P. Gusev, Z. Karim, D. Misra, Y. Obeng, S. DeGendt, H. Jagannathan

Research output: Contribution to journalEditorialpeer-review

Original languageEnglish (US)
Pages (from-to)III
JournalECS Transactions
Volume89
Issue number3
StatePublished - Jan 1 2019
EventInternational Symposium on Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post-CMOS Applications 9 - 235th ECS Meeting - Dallas, United States
Duration: May 26 2019May 30 2019

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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