Preface

  • P. J. Timans
  • , F. Roozeboom
  • , K. Kakushima
  • , E. P. Gusev
  • , Z. Karim
  • , D. Misra
  • , Y. Obeng
  • , S. DeGendt
  • , H. Jagannathan

Research output: Contribution to journalEditorialpeer-review

Original languageEnglish (US)
Pages (from-to)III
JournalECS Transactions
Volume89
Issue number3
StatePublished - 2019
EventInternational Symposium on Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post-CMOS Applications 9 - 235th ECS Meeting - Dallas, United States
Duration: May 26 2019May 30 2019

All Science Journal Classification (ASJC) codes

  • General Engineering

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