Abstract
The purpose of this paper is to investigate the viability of fabricating SCALPEL (SCattering with Angular Limitation in Projection Electron-beam Lithography) masks at a DuPont Photomasks, Inc. (DPI) commercial mask shop. The MEBES 4500 electron beam exposure system and standard inspection tools were used in SCALPEL manufacture to study the key issues to be overcome and the key components needed to succeed in large-scale manufacture. SCALPEL is a next generation lithography technology being researched and developed at Lucent Technologies as the semiconductor industry moves beyond optical lithography. The SCALPEL tool uses a membrane-type mask for high-resolution patterning on Si wafers. SCALPEL mask manufacturing presents new and challenging operations in a commercial mask production facility. The production sequence of SCALPEL masks is not uncommon to the current Cr/Qz environment, but introduces the commercial facility to issues at a different level. SCALPEL mask exposure has been accomplished using MEBES III and an advanced MEBES 4500 e-beam lithography system. Pattern imaging, C.D. metrology, defect inspection, registration metrology, mask handling, and cleaning operations have been attempted with various levels of success. Data and further development of the processes in the commercial facility, along with the challenges and results of these experiences, are detailed in this presentation.
Original language | English (US) |
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Pages (from-to) | 162-170 |
Number of pages | 9 |
Journal | Proceedings of SPIE - The International Society for Optical Engineering |
Volume | 3676 |
Issue number | I |
DOIs | |
State | Published - 1999 |
Externally published | Yes |
Event | Proceedings of the 1999 Emerging Lithographic Technologies III - Santa Clara, CA, USA Duration: Mar 15 1999 → Mar 17 1999 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering