@inproceedings{12bb8eef970e44b5b5bc24b623127ae9,
title = "Pulsed laser annealing: A scalable and practical technology for monolithic 3D IC",
abstract = "Classical dimensional scaling faces challenges from growing on-chip interconnect time delays, and escalating lithography costs and layout limitations. In this paper, we present practical integration schemes for developing cost-efficient 3D ICs in a monolithic fashion, which employ fully depleted transistor channels and laser annealing to achieve sharper junction definition.",
keywords = "3D integration, SOI, laser annealing, simulation",
author = "Bipin Rajendran and Henning, {Albert K.} and Brian Cronquist and Zvi Or-Bach",
year = "2013",
doi = "10.1109/3DIC.2013.6702386",
language = "English (US)",
isbn = "9781467364843",
series = "2013 IEEE International 3D Systems Integration Conference, 3DIC 2013",
booktitle = "2013 IEEE International 3D Systems Integration Conference, 3DIC 2013",
note = "2013 IEEE International 3D Systems Integration Conference, 3DIC 2013 ; Conference date: 02-10-2013 Through 04-10-2013",
}