Pulsed laser annealing: A scalable and practical technology for monolithic 3D IC

Bipin Rajendran, Albert K. Henning, Brian Cronquist, Zvi Or-Bach

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Scopus citations

Abstract

Classical dimensional scaling faces challenges from growing on-chip interconnect time delays, and escalating lithography costs and layout limitations. In this paper, we present practical integration schemes for developing cost-efficient 3D ICs in a monolithic fashion, which employ fully depleted transistor channels and laser annealing to achieve sharper junction definition.

Original languageEnglish (US)
Title of host publication2013 IEEE International 3D Systems Integration Conference, 3DIC 2013
DOIs
StatePublished - 2013
Externally publishedYes
Event2013 IEEE International 3D Systems Integration Conference, 3DIC 2013 - San Francisco, CA, United States
Duration: Oct 2 2013Oct 4 2013

Publication series

Name2013 IEEE International 3D Systems Integration Conference, 3DIC 2013

Other

Other2013 IEEE International 3D Systems Integration Conference, 3DIC 2013
Country/TerritoryUnited States
CitySan Francisco, CA
Period10/2/1310/4/13

All Science Journal Classification (ASJC) codes

  • Computer Graphics and Computer-Aided Design
  • Computer Science Applications

Keywords

  • 3D integration
  • SOI
  • laser annealing
  • simulation

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